Thermal Gap Pad For Ev 18650 Battery - Chinaprice: 14.30 Dollar US$
Low Density & Low Hardness Thermal pad series offers a high thermal conductivity and a low thermal resistance solution that outperforms common thermal pad and solution.
This series of products are resilient and good amount of deformation, Suitable for large institutional design tolerances, Product is Low Density, The Double layer use of special ultra-thin fabric reinforcement, Heavy resistance and increased workability, whether punching punch, strip type, Malformation designs may not be broken and variant. This product is one-sided self-adhesive silicone gel. Self-adhesive never recede. No corrosion on the Copper surface. Completely non-toxic and green products accord to international requirements. It is considered an important tool in meeting higher performance targets for next generation devices.
Designed for automotive
Designed for low-stress
Fiberglass reinforced for puncture, shear and tear resistance
- Phone: 8675527579310
- Address: Block 45 Baoan Dist, Shenzhen, China
- Website: http://www.glpoly.com.cn
Published date: October 18, 2016 -
- Business Description: Founded in 1997, engaging in the design, development and manufacture of Thermal Interface Materials(Soft thermal conductive Silicone thermal pad, Silicone Thermal Grease, Silicone Thermal Putty pad, Silicone Thermal Tape, Silicone Gel, Non silicone gap filler, silicone free thermal pad, non silicone grease.
We are committed to becoming a leading enterprise in the field of thermal interface materials. No significant quality complaint for 18 consecutive years. At Goldlink, developing high quality Thermal Interface Materials and Thermal Solution for electronics industry is our first priority.
Silicone Thermal Gap FillerChemicals - Silica - Shenzhen Goldlink Tongda Electronics Co., Ltd - China - October 18, 2016 - 12.01 Dollar US$
Introduction Silicone thermal gap filler (themral putty gel)is Syringe packaging, automated production, high temperature resistance, and 100% thermal curing putty. XK-G series is a silicone based, high performance thermal Gel, filling with a variety ...
Silicone Free Thermal Putty GelChemicals - Silica - Shenzhen Goldlink Tongda Electronics Co., Ltd - China - October 18, 2016 - 12.20 Dollar US$
Introduction: Silicone free thermal gap filler is Syringe packaging, automated production, high temperature, non-corrosive to metal, 100% thermal curing putty. XK-GN series is a high thermal performance Gel, it based on TPR, Filled with a variety of ...
Silicone Thermal Gap PadChemicals - Silica - Shenzhen Goldlink Tongda Electronics Co., Ltd - China - October 18, 2016 - 9.40 Dollar US$
Introduction Silicone thermal gap pad is resilient and with large deformation, suitable for large institutional design tolerances. Single or Double layer structure, The Double layer is reinforced with special ultra-thin fabric to increase resistance ...
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