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Thermal Conductivity Silicone Gel Pad Interface Materials - China
price: contact company for price
Model: XK- P20S20
Introduction
This series of products are resilient, suitable for large institutional design tolerances.
Product is Double- layer structure, reinforcing with special ultra- thin fabric.
Good resistance to punching, strip type, Malformation designs.
Two- sided self- adhesive and never recede.
No corrosion to the Copper surface.
Completely non- toxic and green products accord to international requirements
Features
Ultra conformability
Designed for low- stress applications
Fiberglass reinforced for puncture, shear and tear resistance
unit XK- P20S20 method
Color Pink visual
Reinforcement Carrierfiberglass
Inherent Surface Tack ( 1- / 2- sided) 2- side
Thickness mm 0.3~5.0 ASTM D374
Density g/ cm3 2.7 ASTM D792
Hardness Shore 00 20 ASTM D2240
Application temperature ℃ - 60~200
Tensile Strength.
psi >200 ASTM D412
Elongation % <10 ASTM D412
Total mass loss % <0.5 ASTM E595
Dielectric breakdown KV/ mm >10 ASTM D149
Volume resistivity Ohm- m >10^11 ASTM D257
Thermal Conductivity W/ m* K 2.0 Hotdisk
Company Contact:
- Phone: 8675527579310
- Address: Block 45 Baoan Dist, Shenzhen , China
- Email:
- Website: https://www.glpoly.com
Published date: February 1, 2016
- Business Description: Offering Thermal Interface Materials(thermal gap pad, Thermal Grease, Thermal gap filler, Silicone Thermal Tape, Silicone Gel, Non silicone thermal gap filler, silicone free thermal pad, non silicone grease, etc.
We are committed to becoming a leading enterprise in the field of thermal interface materials.
No significant quality complaint for 18 consecutive years.
At Goldlink, developing high quality Thermal Interface Materials and Thermal Solution for electronics industry is our first priority.
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