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Thermal Conductivity Silicone Gel Pad Interface Materials - China

price: contact company for price

Model: XK- P20S20

Introduction

This series of products are resilient, suitable for large institutional design tolerances. Product is Double- layer structure, reinforcing with special ultra- thin fabric. Good resistance to punching, strip type, Malformation designs. Two- sided self- adhesive and never recede. No corrosion to the Copper surface. Completely non- toxic and green products accord to international requirements

Features

Ultra conformability

Designed for low- stress applications

Fiberglass reinforced for puncture, shear and tear resistance

unit XK- P20S20 method

Color Pink visual

Reinforcement Carrierfiberglass

Inherent Surface Tack ( 1- / 2- sided) 2- side

Thickness mm 0.3~5.0 ASTM D374

Density g/ cm3 2.7 ASTM D792

Hardness Shore 00 20 ASTM D2240

Application temperature ℃ - 60~200

Tensile Strength.psi >200 ASTM D412

Elongation % <10 ASTM D412

Total mass loss % <0.5 ASTM E595

Dielectric breakdown KV/ mm >10 ASTM D149

Volume resistivity Ohm- m >10^11 ASTM D257

Thermal Conductivity W/ m* K 2.0 Hotdisk


Company Contact:


  • Phone: 8675527579310

  • Address: Block 45 Baoan Dist, Shenzhen, China

  • Email: Email


Published date: February 1, 2016 -

  • Business Description: Founded in 1997, engaging in the design, development and manufacture of Thermal Interface Materials(Soft thermal conductive Silicone thermal pad, Silicone Thermal Grease, Silicone Thermal Putty pad, Silicone Thermal Tape, Silicone Gel, Non silicone gap filler, silicone free thermal pad, non silicone grease.
    etc.
    We are committed to becoming a leading enterprise in the field of thermal interface materials. No significant quality complaint for 18 consecutive years. At Goldlink, developing high quality Thermal Interface Materials and Thermal Solution for electronics industry is our first priority.

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