Thermally Conductive Silicone Fiberglass Xk F15 Thermal Interface Materials - Chinaprice: contact company for price
Unlike traditional low thermal conductivity fiberglass with ceramic powder filler, XK- F series is a composite of high performance ceramic filler and 30um thin fiberglass, achieving high thermal conductivity on flatness surface with low pressure. Recommended using for TO220/ TO3P where insulation is needed.
Elastomeric compound coated on both sides
No oil bleed, long term stability
ã€€ unit XK- F15 XK- F35 XK- F60 Method
Reinforcement Carrier ã€€ Fiberglass ã€€
Color ã€€ Yellow White White visual
Thickness mm 0.2~0.5 0.3 / 0.38 0.2~0.5 ASTM D374
Specific Gravity g/ cm3 2.4 1.8 1.6 ASTM D792
Hardness Shore A 85 ASTM D2240
Thermal impedance â„ƒin2/ W 0.48 0.2 0.16 ASTM D5470
Thermal Conductivity W/ mK 1.5 3.5 5.8 HOT DISK
Volume Resistivity Î©cmASTM D257
Breakdown Voltage KV >3.5 >4 >3.5 ASTM D149
Dielectric Constant 1 63 3.2 ASTM D150
Application temperature â„ƒ - 50~220 ã€€
Tensile strength psi >1000 >500 >300 ASTM D149
Elongation % <10 ASTM D149
Siloxane Volatiles D4~D20 % <0.01 GC- FID
Flammability UL94 V- 0 UL94
- Phone: 8675527579310
- Address: Block 45 Baoan Dist, Shenzhen, China
- Website: http://www.glpoly.com.cn
Published date: February 1, 2016 -
- Business Description: Founded in 1997, engaging in the design, development and manufacture of Thermal Interface Materials(Soft thermal conductive Silicone thermal pad, Silicone Thermal Grease, Silicone Thermal Putty pad, Silicone Thermal Tape, Silicone Gel, Non silicone gap filler, silicone free thermal pad, non silicone grease.
We are committed to becoming a leading enterprise in the field of thermal interface materials. No significant quality complaint for 18 consecutive years. At Goldlink, developing high quality Thermal Interface Materials and Thermal Solution for electronics industry is our first priority.
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