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Two Part Thermal Conductive Silicone Gel Xk S10 - China

price: contact company for price

Features

1: 1 mix ( no cure by- product)

Ultra Soft, low stress applications

Fluid & Easy to assemble

Fast Cure by heating

Typical Applications Include:

 Automotive electronics

 Telecommunications

 Computer and peripherals

 Thermally conductive vibration damping

 Between any heat- generating semiconductor and heat sink

XK- S10

Thermal Conductivity W/ m* K - - - - - - - 1.0 / ASTM D5470

Mixed Viscosity cps - - - - - - - 110, 000 / ASTM D2196


Company Contact:


  • Phone: 8675527579310

  • Address: Block 45 Baoan Dist, Shenzhen, China

  • Email: Email


Published date: February 2, 2016 -

  • Business Description: Founded in 1997, engaging in the design, development and manufacture of Thermal Interface Materials(Soft thermal conductive Silicone thermal pad, Silicone Thermal Grease, Silicone Thermal Putty pad, Silicone Thermal Tape, Silicone Gel, Non silicone gap filler, silicone free thermal pad, non silicone grease.
    etc.
    We are committed to becoming a leading enterprise in the field of thermal interface materials. No significant quality complaint for 18 consecutive years. At Goldlink, developing high quality Thermal Interface Materials and Thermal Solution for electronics industry is our first priority.

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