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4 Layer Mobile Phone Mainboard Bga Pcb With Eing Surface - China
price: contact company for price
Specifications:
Base material: PTFE, PCB, FR4
Layer count: 4- layer board
Board thickness: 0.8mm
Copper thickness: 1oz
Surface finishing: ENIG
Soldermask color: green
Available specifications:
Base materials: FR4, aluminum, FPC and copper
Copper thickness: 0.5oz ( minimum)
Copper thickness: 4oz ( minimum)
Board thickness: 0.2mm ( minimum)
Board thickness: 3.2mm ( maximum)
Surface finishing: HAL, ENIG, OSP, gold finger and tin chemistry
Possible soldermask colors: green, black, white, yellow, blue, red and more
Board dimensions: 600 x 1, 000mm
Hole diameter: 0.2mm ( minimum)
Line width: 0.075mm ( minimum)
Line spacing: 0.075mm ( minimum)
SMT pitch: 30° ( minimum)
Annular ring: 0.05mm ( minimum)
Aspect ratio: 11: 01
Surface/ hole plating tolerance:
Hole tolerance ( PTH) : 0.25mm
Hole tolerance ( NPTH) : 0.15mm
SM tolerance ( LPI) : Dimension
Electrically test: supported
RoHS Directive- compliant
Possibility of SMT device mounting: supported
Company Contact:
- Posted By: cirket electronics company
- Phone: 008675586215150
- Address: :3F,Block B1,HengFeng Ind.Zone,Hezhou,Xixiang,B aoA, shenzhen , China
- Email:
- Website: https://www.szckt.cn
Published date: August 26, 2014
- Business Description: The products extends from 2 20 layer FR4 circuit boards, single/double
sided aluminum base /copper base circuit boards, to 2 8 layer high
frequency microwave circuit boards and double sided /multilayer 2 6 OZ
heavy copper circuit boards.
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