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  • 4 Layer Mobile Phone Mainboard Bga Pcb With Eing Surface - China

    price: contact company for price

    Specifications:

    Base material: PTFE, PCB, FR4

    Layer count: 4- layer board

    Board thickness: 0.8mm

    Copper thickness: 1oz

    Surface finishing: ENIG

    Soldermask color: green

    Available specifications:

    Base materials: FR4, aluminum, FPC and copper

    Copper thickness: 0.5oz ( minimum)

    Copper thickness: 4oz ( minimum)

    Board thickness: 0.2mm ( minimum)

    Board thickness: 3.2mm ( maximum)

    Surface finishing: HAL, ENIG, OSP, gold finger and tin chemistry

    Possible soldermask colors: green, black, white, yellow, blue, red and more

    Board dimensions: 600 x 1, 000mm

    Hole diameter: 0.2mm ( minimum)

    Line width: 0.075mm ( minimum)

    Line spacing: 0.075mm ( minimum)

    SMT pitch: 30° ( minimum)

    Annular ring: 0.05mm ( minimum)

    Aspect ratio: 11: 01

    Surface/ hole plating tolerance:

    Hole tolerance ( PTH) : 0.25mm

    Hole tolerance ( NPTH) : 0.15mm

    SM tolerance ( LPI) : Dimension

    Electrically test: supported

    RoHS Directive- compliant

    Possibility of SMT device mounting: supported


    Company Contact:


    • Phone: 008675586215150

    • Address: :3F,Block B1,HengFeng Ind.Zone,Hezhou,Xixiang,BaoA, shenzhen, China

    • Email: Email


    Published date: August 26, 2014 -

    • Business Description: The products extends from 2 20 layer FR4 circuit boards, single/double

      sided aluminum base /copper base circuit boards, to 2 8 layer high

      frequency microwave circuit boards and double sided /multilayer 2 6 OZ

      heavy copper circuit boards.

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