Hdi Pcb With Buried Blind Laser Via For Mobile Phone - Chinaprice: contact company for price
PCB. Finer line and space, laser microvia and capture
pad, higher connection pad density and high performance thin
materials are its most prominent features.
1) HDI Structure: 1+N+1, 2+N+2
2) Min Laser Via Diameter: 5mil
3) Min One- sided Target Pad of Laser Via: 3.5mil
4) Embedded Passive Components
- Posted By: Jetsun Electronic Technology CO.,LTD
- Phone: 8675586094680
- Address: Lihao Science Park, 4th Industrial Zone, Xitian, G, Shenzhen, China
- Website: http://www.jetsunpcb.com
Published date: September 28, 2014 -
- Business Description: JETSUN ELECTRONIC TECHNOLOGY CO., LIMITED specializes in the PCB
manufacturing to the Global electronics industry for 10 years. The
application industries including:
JETSUN electronic offers a wide range of high quality products including :
1)Common Rigid PCB ( 2~28 layers),
2)Flex and rigid & flex PCB,
3)Metal substrates/Heat sink PCB,
4)High frequency(RF/Microwave) PCB ,
5)Heavy copper PCB,
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