Camera Module With 2 Megapixel - Chinaprice: 14.89 Dollar US$
Sanm Technology Co., Ltd. has successfully developed and manufactured 300K, 1.3M and 2.0M pixels of the CMOS Camera modules (CCM) by our leading patented technology. Much high-end models like 3.0M and 5.0M CMOS Camera Modules are under developed by our R&D teams in Shenzhen and will be launched soon.
As we know, there are many CMOS Camera Module manufacturers are all over the world and are always in full swing in the markets. But we are very proud of our product qualities and we do believe that we can provide the best service.
This product has an image array capable of operating at up to 15 frames per second(fps) in SXGA resolution with complete user control over image quality, formatting and output data transfer. All required image processing functions, including exposure control, gamma, white balance, color saturation, hue control, defect pixel canceling, noise canceling and more, are also programmable through the SCCB interface.
This model supports the UVC (USB-Video-Class) drive provided by Microsoft as capture driver so it can operate on WindowXP-SP2 without installing another capture drive, and also can operate on Windows-Vista/Linux system.
Sensor: HM2050 CMOS sensor
Pixels: 2mega (UXGA)
Top resolution:1600*1200 dpi
Lens type: 1/5 inch
FOV: 68 degree
Size: 60mmX8mmX5.2mm(customize available).
- Posted By: Sanm Technology Co., Ltd
- Phone: 86-13760158300
- Address: B1-322,No.168 Baoyuan Road,Xixiang town,Bao'an district,Shenzhen,China , Shenzhen, Guangdong Province, China
- Website: http://www.sanmtech.com
Published date: August 10, 2016 - Modified date: August 10, 2016
- Business Description: Sanmtech, gold member of "Made-in-China".
1) 2 domestic OEM factories, 200+ workers, 9 years experience;
2) 5 years vendor of Camera Module Service;
3) Wholly automatic production lines had been set up in Shenzhen China;
This is how we keep superior quality and competitive offers for global valued customers.
Our capabilities and services include:
1) PCB building;
2) Sample & Prototype Building;
3) Component Procurement, Material Management;
4) PCB Assembly , In-circuit Test and Functional Testing.
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