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  • Silicone Soft Pad Xk P60 Thermal Interface Material Conductive - China

    price: contact company for price

    Introduction

    This series of products are resilient and with large deformation, suitable for large institutional design tolerances. Single or Double layer structure, The Double layer is reinforced with special ultra- thin fabric to increase resistance and workability of punching, strip type, Malformation designs. Self- adhesive and never recede. No corrosion to the Copper surface, “enviromentally friendly products”.

    Features

    Ultra conformable, “gel- like” modulus

    Designed for low- stress applications

    low hardness

    Applications

    Telecommunications

    Computer, Between heat- generating semiconductor and a heat sink

      unit XK- P12 XK- P15 XK- P25 XK- P30 XK- P45 XK- P50 XK- P60 XK- P80 Method

    Reinforcement Carrier With ( F) or Without Fiber Hard Layer ( H) or Without Fiber  

    Inherent Surface Tack  

    Color Gray Green Yellow Light Blue Gray Red Gray light Gray visual

    Thickness mm 0.3~3.0 0.3~3.0 0.3~3.0 0.5~2.0 ASTM D374

    Specific Gravity g/ cm3 2.12 2.44 2.73 3.1 3.24 3.35 3.45 3.55 ASTM D792

    Hardness Asker C 3~4 3~5 15~18 15~20 25~30 25~30 35~40 50 JIS K7312

      Shore 00 25~35 30~40 40~50 40~50 45~55 45~55 50~60 80 ASTM D2240

    Thermal impedance @ 0.5mm 14.5psi ℃in2/ W 0.65 0.59 0.35 0.28 0.26 0.21 0.16 0.13 ASTM D5470

    Thermal Conductivity W/ mK 1.2 1.5 2.5 3 4.5 5 6 8 HOT DISK

    Volume Resistivity Ωcm ASTM D257

    Breakdown Voltage KV/ mm 16 16 16 15 ASTM D149

    Dielectric Constant 1 5.2 5.5 6.5 7 8 8 8.5 9 ASTM D150

    Application temperature ℃  

    Tensile strength psi 14 15 13 13 23 12 10 10 ASTM D149

    Elongation % 200 130 100 80 50 40 30 20 ASTM D149

    Siloxane Volatiles D4~D20 % <0.005 <0.005 <0.003 <0.001 GC- FID

    Flammability UL94 UL94


    Company Contact:


    • Phone: 8675527579310

    • Address: Block 45 Baoan Dist, Shenzhen, China

    • Email: Email


    Published date: January 29, 2016 -

    • Business Description: Founded in 1997, engaging in the design, development and manufacture of Thermal Interface Materials(Soft thermal conductive Silicone thermal pad, Silicone Thermal Grease, Silicone Thermal Putty pad, Silicone Thermal Tape, Silicone Gel, Non silicone gap filler, silicone free thermal pad, non silicone grease.
      etc.
      We are committed to becoming a leading enterprise in the field of thermal interface materials. No significant quality complaint for 18 consecutive years. At Goldlink, developing high quality Thermal Interface Materials and Thermal Solution for electronics industry is our first priority.

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