Silicone Soft Pad Xk P60 Thermal Interface Material Conductive - Chinaprice: contact company for price
This series of products are resilient and with large deformation, suitable for large institutional design tolerances. Single or Double layer structure, The Double layer is reinforced with special ultra- thin fabric to increase resistance and workability of punching, strip type, Malformation designs. Self- adhesive and never recede. No corrosion to the Copper surface, â€œenviromentally friendly productsâ€.
Ultra conformable, â€œgel- likeâ€ modulus
Designed for low- stress applications
Computer, Between heat- generating semiconductor and a heat sink
ã€€ unit XK- P12 XK- P15 XK- P25 XK- P30 XK- P45 XK- P50 XK- P60 XK- P80 Method
Reinforcement Carrier With ( F) or Without Fiber Hard Layer ( H) or Without Fiber ã€€
Inherent Surface Tack ã€€
Color Gray Green Yellow Light Blue Gray Red Gray light Gray visual
Thickness mm 0.3~3.0 0.3~3.0 0.3~3.0 0.5~2.0 ASTM D374
Specific Gravity g/ cm3 2.12 2.44 2.73 3.1 3.24 3.35 3.45 3.55 ASTM D792
Hardness Asker C 3~4 3~5 15~18 15~20 25~30 25~30 35~40 50 JIS K7312
ã€€ Shore 00 25~35 30~40 40~50 40~50 45~55 45~55 50~60 80 ASTM D2240
Thermal impedance @ 0.5mm 14.5psi â„ƒin2/ W 0.65 0.59 0.35 0.28 0.26 0.21 0.16 0.13 ASTM D5470
Thermal Conductivity W/ mK 1.2 1.5 2.5 3 4.5 5 6 8 HOT DISK
Volume Resistivity Î©cm ASTM D257
Breakdown Voltage KV/ mm 16 16 16 15 ASTM D149
Dielectric Constant 1 5.2 5.5 6.5 7 8 8 8.5 9 ASTM D150
Application temperature â„ƒ ã€€
Tensile strength psi 14 15 13 13 23 12 10 10 ASTM D149
Elongation % 200 130 100 80 50 40 30 20 ASTM D149
Siloxane Volatiles D4~D20 % <0.005 <0.005 <0.003 <0.001 GC- FID
Flammability UL94 UL94
- Phone: 8675527579310
- Address: Block 45 Baoan Dist, Shenzhen, China
- Website: http://www.glpoly.com.cn
Published date: January 29, 2016 -
- Business Description: Founded in 1997, engaging in the design, development and manufacture of Thermal Interface Materials(Soft thermal conductive Silicone thermal pad, Silicone Thermal Grease, Silicone Thermal Putty pad, Silicone Thermal Tape, Silicone Gel, Non silicone gap filler, silicone free thermal pad, non silicone grease.
We are committed to becoming a leading enterprise in the field of thermal interface materials. No significant quality complaint for 18 consecutive years. At Goldlink, developing high quality Thermal Interface Materials and Thermal Solution for electronics industry is our first priority.
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