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  • Thermal Conductive Silicone Fiberglass Xk F15 Interface - China

    price: contact company for price

    Introduction

    Unlike traditional low thermal conductivity fiberglass with ceramic powder filler, XK- F series is a composite of high performance ceramic filler and 30um thin fiberglass, achieving high thermal conductivity on flatness surface with low pressure.

    Recommended using for TO220/ TO3P where insulation is needed.

    Features

    Elastomeric compound coated on both sides

    No oil bleed, long term stability

    Electrical insulating

    Applications

    Power supplies

    Automotive electronics

    Motor controls

    Power semiconductors

      unit- - - - XK- F15/ XK- F35/ XK- F60 Method

    Reinforcement Carrier   Fiberglass/  

    Thickness mm- - - - 0.2~0.5/ 0.3 / 0.38/ 0.2~0.5 ASTM D374

    Specific Gravity g/ cm3- - - - 2.4/ 1.8/ 1.6 ASTM D792

    Hardness Shore A- - - - 80/ 80/ 85ASTM D2240

    Thermal impedance ℃in2/ W- - - - 0.48/ 0.2/ 0.16 ASTM D5470

    Thermal Conductivity W/ mK- - - - 1.5/ 3.5/ 5.8 HOT DISK

    Volume ResistivityΩcm- - - - >1013/ >1013/ >1013 ASTM D257

    Breakdown VoltageKV- - - - >3.5/ >4 / >3.5 ASTM D149


    Company Contact:


    • Phone: 8675527579310

    • Address: Block 45 Baoan Dist, Shenzhen , China

    • Email: Email


    Published date: February 2, 2016

    • Business Description: Offering Thermal Interface Materials(thermal gap pad, Thermal Grease, Thermal gap filler, Silicone Thermal Tape, Silicone Gel, Non silicone thermal gap filler, silicone free thermal pad, non silicone grease, etc.

      We are committed to becoming a leading enterprise in the field of thermal interface materials.

      No significant quality complaint for 18 consecutive years.

      At Goldlink, developing high quality Thermal Interface Materials and Thermal Solution for electronics industry is our first priority.

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