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  • Thermal Conductivity Silicone Gel Pad Interface Materials - China

    price: contact company for price

    Model: XK- P20S20

    Introduction

    This series of products are resilient, suitable for large institutional design tolerances. Product is Double- layer structure, reinforcing with special ultra- thin fabric. Good resistance to punching, strip type, Malformation designs. Two- sided self- adhesive and never recede. No corrosion to the Copper surface. Completely non- toxic and green products accord to international requirements

    Features

    Ultra conformability

    Designed for low- stress applications

    Fiberglass reinforced for puncture, shear and tear resistance

    unit XK- P20S20 method

    Color Pink visual

    Reinforcement Carrierfiberglass

    Inherent Surface Tack ( 1- / 2- sided) 2- side

    Thickness mm 0.3~5.0 ASTM D374

    Density g/ cm3 2.7 ASTM D792

    Hardness Shore 00 20 ASTM D2240

    Application temperature ℃ - 60~200

    Tensile Strength.psi >200 ASTM D412

    Elongation % <10 ASTM D412

    Total mass loss % <0.5 ASTM E595

    Dielectric breakdown KV/ mm >10 ASTM D149

    Volume resistivity Ohm- m >10^11 ASTM D257

    Thermal Conductivity W/ m* K 2.0 Hotdisk


    Company Contact:


    • Phone: 8675527579310

    • Address: Block 45 Baoan Dist, Shenzhen, China

    • Email: Email


    Published date: February 1, 2016 -

    • Business Description: Founded in 1997, engaging in the design, development and manufacture of Thermal Interface Materials(Soft thermal conductive Silicone thermal pad, Silicone Thermal Grease, Silicone Thermal Putty pad, Silicone Thermal Tape, Silicone Gel, Non silicone gap filler, silicone free thermal pad, non silicone grease.
      etc.
      We are committed to becoming a leading enterprise in the field of thermal interface materials. No significant quality complaint for 18 consecutive years. At Goldlink, developing high quality Thermal Interface Materials and Thermal Solution for electronics industry is our first priority.

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