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  • Thermally Conductive Silicone Fiberglass Xk F15 Thermal Interface Materials - China

    price: contact company for price

    Introduction

    Unlike traditional low thermal conductivity fiberglass with ceramic powder filler, XK- F series is a composite of high performance ceramic filler and 30um thin fiberglass, achieving high thermal conductivity on flatness surface with low pressure. Recommended using for TO220/ TO3P where insulation is needed.

    Features

    Elastomeric compound coated on both sides

    No oil bleed, long term stability

    Electrical insulating

    Applications

    Power supplies

    Automotive electronics

    Motor controls

    Power semiconductors

      unit XK- F15 XK- F35 XK- F60 Method

    Reinforcement Carrier   Fiberglass  

    Color   Yellow White White visual

    Thickness mm 0.2~0.5 0.3 / 0.38 0.2~0.5 ASTM D374

    Specific Gravity g/ cm3 2.4 1.8 1.6 ASTM D792

    Hardness Shore A 85 ASTM D2240

    Thermal impedance ℃in2/ W 0.48 0.2 0.16 ASTM D5470

    Thermal Conductivity W/ mK 1.5 3.5 5.8 HOT DISK

    Volume Resistivity ΩcmASTM D257

    Breakdown Voltage KV >3.5 >4 >3.5 ASTM D149

    Dielectric Constant 1 63 3.2 ASTM D150

    Application temperature ℃ - 50~220  

    Tensile strength psi >1000 >500 >300 ASTM D149

    Elongation % <10 ASTM D149

    Siloxane Volatiles D4~D20 % <0.01 GC- FID

    Flammability UL94 V- 0 UL94


    Company Contact:


    • Phone: 8675527579310

    • Address: Block 45 Baoan Dist, Shenzhen, China

    • Email: Email


    Published date: February 1, 2016 -

    • Business Description: Founded in 1997, engaging in the design, development and manufacture of Thermal Interface Materials(Soft thermal conductive Silicone thermal pad, Silicone Thermal Grease, Silicone Thermal Putty pad, Silicone Thermal Tape, Silicone Gel, Non silicone gap filler, silicone free thermal pad, non silicone grease.
      etc.
      We are committed to becoming a leading enterprise in the field of thermal interface materials. No significant quality complaint for 18 consecutive years. At Goldlink, developing high quality Thermal Interface Materials and Thermal Solution for electronics industry is our first priority.

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