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High Quality Tsv Led Interposer Wlp - Korea

price: contact company for price

EPworks Co. Ltd. was established for semiconductor package R&D services,

product manufacturing

Responsibimy and market sales. EPworks has held a dominant position in its market in Korea and globally by combining

3D IC/TSV-WLP/lnterposer services with its progressive marketing plans and business strategies.

EPWorks named by Electro-Package Working Group for 3D IC and Package using TSV

Study (Through-Si-Vias) Technology. Company was named one of the Global Leading 3D IC Players

by Yole Developpment, Fr. EPWorks's trademark 'g-STACK' technology has become the basis of all

Tggeiher Wafer-to-Wafer technology for TSV-3D IC/Packages.

3D IC/TSV-WLP/lnterposer Packaging, which utilizes semiconductor FAB technology, is the technology that has made Korea

competitive in the semiconductor area and achieved semiconductor back-end. 3D IC/TSV-WLP/lnterposer technology is the most

efficient and optimal among the existing technologies for miniaturization and high functionality. Therefore EPWorks's business has

a Low-Risk Model and High technology barrier model to entry.

High Quality Tsv Led Interposer Wlp

Feel free to contact us with all your questions


Company Contact:


  • Phone: 82317897889

  • Address: 310, Adv. R&D KETI 68 Yatap-dong, Bundang-gu, Seongnam, Gyeonggi, Korea

  • Email: Email

Published date: September 7, 2012 -

  • Business Description: EPworks Co. Ltd. is the established for semiconductor package R&D service, product manufacture and market sale. EPworks is the First Mover Advantage in Korea and globally by combining 3D IC/TSV WLP/Interposer services with its progressive marketing plan and business strategy. EPWorks was named by Electro Package Working Group for 3D IC and Package using TSV(Through Si Vias) Technology. Company was named one of the Global Leading 3D IC Players by Yole Developpment, Fr. EPWorks's trademark "g STACK' technology becomes basis of all Wafer to Wafer technology for TSV 3D IC/Package. 3D IC/TSV WLP/Interposer Packaging, which utilizes semiconductor FAB technology, is the technology that has made Korea competitive in the semiconductor area and to achieve semiconductor backend. 3D IC/TSV WLP/Interposer technology is the most efficient and optimal among the existing technologies for miniaturization and high functionality. Therefore EPWorks's business has Low Risk Model and High technology barrier model to entry. History 2006.07 : Established Company at Gasan Digital, Seoul, Korea 2006.09 : Selected New Idea Biz. KIBO Contest Program 2006.10 : Technical contracted with R&D at University 2006.12 : Registered Korea Venture Company 2007.02 : Est. ESIP R&D Laboratory 2007.04 : Govern R&D Fund for Opto WLP Development 2007.07 : Listed Top 50 3D IC Playerby Yole Developpment 2007.08 : Select Korea Government GM Project 2007.11 : Award City Mayor Biz. Contest 2008.05 : Korea Government R&D Fund for BSI WLP 2008.07 : Listed Korea Bio IT Organization, Seoul 2008.10 : Korea Government R&D Fund for Si Refining Technology 2009.04 : Korea Government R&D Fund for NAND Flash 3D IC 2009.08 : Install Multi cell Si Refine System 2009.09 : Expand Clean Room to Seoul TP in Seoul, Korea 2009.11 : Sold 1st Interposer Wafer 2010.03 : Government R&D for LED Interposer for LED Light 2010.04 : JDP for Interposer with Zycube, Japan 2010.08 : Invested by DasanNetworks for Pilot Production Line. Patents : Registered 1 USA, 1 Taiwan, 1 China, 3 Korea Patents Pending 2 USA, 4 Korea Patents Location : Office at 310, Adv. R&D KETI 68 Yatap dong, Bundang gu, Seongnam, Gyeonggi, Korea Line at 1st Floor Seoul Techno Park , 138 Gongrunggil Nowongu, Seoul, Korea

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