Cog Bonding Machine For Lcd Repair Refurbishing Touch Screen Pannel - Chinaprice: contact company for price
COG bonding machine XCG93- C1,
bonding machines ,
COG bonding machines ,
COG bonder machine ,
COG bonder machines,
1. About the application field of COG bonding machine XCG93- C1( the pressure) ，
COG bonding equipment ( the pressure) is widely used in a variety of LCD display ( LCD) , modules ( LCM) and large- sized display panel production, assembly, maintenance, production enterprises; such as， mobile phones, laptops, LCD monitors, tablet PCs, LCD / LCM production, assembly, repair enterprises.
2. Basic parameters of XCQ77- A1
Input Power， AC220V 50- 60HZ
Vacuum control， vacuum + vacuum generator;
Dimensions， L1000 * W1050 * H1475mm ( excluding warning lights)
Operating modes， 7- inch HMI
Control system ( LG- LS) ， a programmable processor
Pressure gauge， KITA, the number of explicit
Pressure regulator， Japan SMC, precision pressure regulating valve
Pressure accuracy， ± 0.5% full in the degree
Sensitivity， 0.2% full in the degree
Pressure Unit， Kg / N / Mpa / Kpa swap
counterpoint mode， CCD next counterpoint
Platform Work， Fixed
Platform Material， high quality Bakelite
Heating， heating thermostat
Thermocouple， K type
Blade material， 440C
Temperature range， RT- 500
3. About the functions and characteristics of COG bonding machine XCG93- C1( the pressure) ，
3.1 heating curve with digital temperature display synchronization.
3.2 can store 500 groups of function parameters.
3.3 thermocouple output parameters can be adjusted according to the head power.
3.4 SUNSOM twin eliminate structural weight, pressure accurate.
- Phone: 8613760490986
- Address: 4/F, Block C, Liyue industrial park, Fenghuan,Fuy, Shenzhen, China
- Website: http://www.sunsom.hk
Published date: July 11, 2014 -
- Business Description: Shenzhen Sunsom automatic equipment Co.,Ltd .
is a high tech enterprise specialized in R&D,manufacturing and sales of LCD automatic equipment.we stick to the the enterprise spirit of " efficiency and practicality",have successfully developedï¼Œ
Constant Heat Bonding Machine,Pulse Heat Bonding Machine ,ACF Taking Machine,automation bubble removing Machine,Polarizer Delaminator,HSC Bonding Machine ,large size TFT Bonding Machine ,PDP Bonding Machine,COG Alignment Machine,COG Bonding Machine,COG Previous Testor,COG Final Testor,ITO Tester,Opencell Testor and etc.These machines are widely applied to flat panel TFT/LCD .PDA,PDA;soldering of FPC and FFC to PCB ;polarizer removing,polarizer laminating,ACF laminating,polarizer claving process as well as various flat panel displays bonding and connecting process.
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