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  • Butterfly Ceramic Packages For Integrable Tunable Laser Assembly Itla - China

    price: contact company for price

    Low Return Loss: -20dB max.

    (DC~15GHz) Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages.

    The main products are HTCC, LTCC, and ALN ceramic packages and substrates.

    products cover different domains such as optical communication module package, power laser package, microwave device package, high- density integrated circuit package, ALN substrate products and other fields of package.

    Committed to doing a good job for the ceramic package, efforts to build a high quality brand, with sincerely heart to provide the highest quality products.

    HE BEI SINOPACK ELECTRONIC TECH CO., LTD, a company has background in ceramic packaging for more than 60 years, devotes to the R&D and manufacturing of multilayer ceramic packages.

    The main products are HTCC, LTCC, and ALN ceramic packages and substrates.

    products cover different domains such as optical communication module package, power laser package, microwave device package, high- density integrated circuit package, ALN substrate products and other fields of package.

    To be devoted and concentrated, is the target of SINOPACK.

    Committed to doing a good job for the ceramic package, efforts to build a high quality brand, with sincerely heart to provide the highest quality products and the most satisfying service is our perpetual pursuit.

    Either specific design or high-volume production, SINOPACK is committed to meeting customer specification at any time.

    We would like to make our best efforts to grow up together with customers.


    Company Contact:


    • Phone: +86-17732132177

    • Address: No.21 Changsheng Street, Luquan Economic Development Zone, Shijiazhuang , Hebei , China

    • Email: Email


    Published date: March 19, 2018

    • Business Description: HE BEI SINOPACK ELECTRONIC TECH CO., LTD ,a company has background in ceramic packaging for more than 60 years, devotes to the R&D and manufacturing of multilayer ceramic packages.

      The main products are HTCC, LTCC, and ALN ceramic packages and substrates.

      products cover different domains such as optical communication module package, power laser package, microwave device package, high- density integrated circuit package, ALN substrate products and other fields of package.

      To be devoted and concentrated, is the target of SINOPACK.

      Committed to doing a good job for the ceramic package , efforts to build a high quality brand, with sincerely heart to provide the highest quality products and the most satisfying service is our perpetual pursuit.

      Either specific design or high-volume production, SINOPACK is committed to meeting customer specification at any time.

      We would like to make our best efforts to grow up together with customers.

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