China 64gb 128gb Bga Nand Flash - China

Our 64GB 128GB BGA NAND flash delivers compact, high-performance storage in a Ball Grid Array package.

Designed for soldered-down applications, this high density BGA NAND module provides excellent electrical and thermal performance while maintaining strong mechanical stability under vibration and shock.

Ideal for space-constrained industrial designs, our industrial 64GB BGA NAND and 128GB BGA NAND flash combine advanced NAND technology with robust rugged BGA packaging, ensuring long-term data integrity in demanding environments.

Stable operation over 0-70°C temperature range, strong shock/vibration resistance, ensuring reliable data storage and transmission in industrial environments.

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Key Features of Our 64GB 128GB BGA NAND

High Density BGA NAND Module: Array of solder balls enables higher I/O count in smaller footprint compared to traditional packages.

Wide Temperature BGA NAND: Supports extended operating ranges suitable for industrial use, with stable performance across temperature fluctuations.

High Reliability BGA NAND: Enhanced power integrity, reduced signal interference, and superior heat dissipation for consistent operation.

High Endurance BGA NAND: Optimized for frequent read/write cycles with robust error correction.

Embedded BGA NAND Solution: Perfect for direct PCB mounting, eliminating connector failure risks in vibration-heavy applications.

Company Contact:

• Posted By: Jiangsu RuiXIN Microelectronics Co., LTD

• Phone: 13662216903

• Address: No. 3, South Side of Bosideng Avenue, Economic Development Zone, Jiangsu, Jiangsu, China

• Email:

• Website: https://www.jsrxw.com/

• Business Description: Our Company was eastablished in November 2021,it is a high-class electronic in-formation manufacturing enterprise focusing on IC packaging and teasting busi-ness(including memory chip,IC packaging,wafer testing service,and chip finished product testing service).