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  • Gold Plated Copper Foil - China

    price: contact company for price

    1, thickness: 0.01mm, 0.018mm, 0.025mm, 0.035mm, 0.05mm, 0.08mm, 0.1mm, 0.15mm 2, resistance: ≤0.01Ω 3, viscosity: ≥1.2KG/25mm 4, thermal conductivity: ≥400W /mk 5, shielding effectiveness: ≥65dB 6, width size: 2mm~1260mm, 2mm*380mm, 2mm~500mm 7, length size: 2M~ANY The gold-plated copper foil produced by our company has extremely low resistance and high conductivity.

    Salt spray test, suitable for 5G mobile phone and other electrical connection feed verification, materials are phosphor bronze, titanium copper, brass, pure copper, etc.


    Company Contact:


    • Phone: 86-0769-85305921

    • Address: Building H, No. 93, Daxin Road, Dazhou Community, Qiaotou Town, Dongguan City, Dongguan , Guangdong , China

    • Email: Email


    Published date: April 1, 2019

    • Business Description: Founded in 2013, Dongguan Dongyan Electronic Material Technology Co., Ltd. It is a professional conductive shielding, heat-dissipating and heat-dissipating material and special adhesive production enterprise integrating R&D, production, sales and service.

      In May 2018, the company moved to the famous lotus town in China---Qiaotou Town, Dongguan.

      Dongyan Electronics specializes in solving a series of shielding and heat dissipation problems such as electromagnetic signal interference, electronic component heating, etc., and develops according to customer needs, and allocates various special materials suitable for the specific production process.

      Dongyan Electronics has introduced two of the most advanced coating production lines in the industry at home and abroad, equipped with standard dust-free workshops for production, ensuring quality and reassuring customers.

      Dongyan Electronics is one of the first companies to participate in the research and development of nano-carbon series heat dissipation, graphene series heat dissipation and other new heat dissipation materials, and has won a good reputation in the industry.

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