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Uowei Lw Pt03 Intelligent Efficient Bga Cpu Ball Soldering Platform - China
price: 7.50 Dollar US$
Description
LUOWEI LW-PT03 LW-PT02 CPU Chip Tin Planting Platform with Heat-resistant Silicone Pad for Electronics/Mobile Phone BGA Chips Soldering Repair.
Anti-slip, no bulging, high temperature resistant.
Luowei multi-function BGA reballing magnetic platform has zero error positioning and expandable base, suitable for chips with thickness less than 0.9mm and double-layer components.
Features:
1 - Versatility: supports a wide range of applications, including welding and chip placement, suitable for CPU, mid-range, hard disk, and BGA chips welding.
2 - With zero error positioning and expandable base, it can meet various welding needs.
3 - Contains strong magnets to ensure that the welding steel mesh fits tightly.
Soft silicone, aluminum base, heat-resistant and easy to clean.
4 - Durable structure: made of high-quality materials to ensure service life and reliability.
5 - Compatible with chips with thickness less than 0.9mm, most smartphone chip auxiliary welding.
6 - Universal expansion base, suitable for middle-layer positioning board.
7 - High toughness, good elasticity, heat-resistant, non-slip, can withstand high temperatures up to 500℃.
8 - High-strength magnetic steel mesh, strong magnetic adsorption design, ensures safer and more stable welding.
9 - Strong magnetic adsorption ensures that the steel mesh is not easy to fall off or shift.
Product list:
1 x Tinning base.
1 x Silicone pad.
Company Contact:
- Posted By: China PHONEFIX Technology Co., Ltd,
- Phone: 17169962783
- Address: JuGuang E-commerce Industrial Park, Building 8, No.9 Qilin Road, BanTian Street, LongGang District, shenzhen , updated , China
- Email:
- Website: https://www.diyfixtool.com/
Published date: January 1, 2025
- Business Description: phonefix "Get the Best Deals on Bulk Mobile Repair Accessories!"
"Equip Your Business with Top-Quality Phone Repair Tools!"
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