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Highlighted Companies

Uowei Lw Pt03 Intelligent Efficient Bga Cpu Ball Soldering Platform - China

price: 7.50 Dollar US$

Description

LUOWEI LW-PT03 LW-PT02 CPU Chip Tin Planting Platform with Heat-resistant Silicone Pad for Electronics/Mobile Phone BGA Chips Soldering Repair.

Anti-slip, no bulging, high temperature resistant.

Luowei multi-function BGA reballing magnetic platform has zero error positioning and expandable base, suitable for chips with thickness less than 0.9mm and double-layer components.

Features:

1 - Versatility: supports a wide range of applications, including welding and chip placement, suitable for CPU, mid-range, hard disk, and BGA chips welding.

2 - With zero error positioning and expandable base, it can meet various welding needs.

3 - Contains strong magnets to ensure that the welding steel mesh fits tightly.

Soft silicone, aluminum base, heat-resistant and easy to clean.

4 - Durable structure: made of high-quality materials to ensure service life and reliability.

5 - Compatible with chips with thickness less than 0.9mm, most smartphone chip auxiliary welding.

6 - Universal expansion base, suitable for middle-layer positioning board.

7 - High toughness, good elasticity, heat-resistant, non-slip, can withstand high temperatures up to 500℃.

8 - High-strength magnetic steel mesh, strong magnetic adsorption design, ensures safer and more stable welding.

9 - Strong magnetic adsorption ensures that the steel mesh is not easy to fall off or shift.

Product list:

1 x Tinning base.

1 x Silicone pad.


Company Contact:


  • Phone: 17169962783

  • Address: JuGuang E-commerce Industrial Park, Building 8, No.9 Qilin Road, BanTian Street, LongGang District, shenzhen , updated , China

  • Email: Email


Published date: January 1, 2025

  • Business Description: phonefix "Get the Best Deals on Bulk Mobile Repair Accessories!"

    "Equip Your Business with Top-Quality Phone Repair Tools!"

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