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Aluminum Copper Clad Laminate - China
price: contact company for price
Specification:
CCL
thickness: 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm, 2.5mm, 3.0mm, 4.
0mm
Thermal conductivity: 1.0W/ m.
k, 1.5W/ m.
k, 2.0W/ m.
k, 3.0W/ m.
k
Dielectric thickness: 80um- 150um
Copper foil: 1OZ, 2OZ, 3OZ
Supply size: 500* 600mm/ 400* 1200mm/ 500* 1200mm/ 600* 1200mm, We
can supply other size upon request.
Item No.
: AL- H- 06
Feature:
Meet the RoHS requirements
Excellent thermal conductivity
Solder excellent performance
Outstanding reliability
Good machinability
Excellent dimensional stability
Electromagnetic wave shielding
Application:
Copper clad laminate is the electronic industrial base
material, mainly used for the manufacture of printed circuit
board ( PCB) , widely applied in television, radio, computer,
mobile communications and other electronic products.
Company Contact:
- Phone: 867525766588
- Address: No.2 Yonglian Rd,Gonglian, Longfeng, Huizhou , China
- Email:
- Website: http://www.greenmarkccl.com
Published date: September 26, 2014
- Business Description: Huizhou Green Mark Photoelectric Technology Co., Ltd was established in
2006, located in Huizhou City, Guangdong Province, China.
We are a
professional manufacturer & exporter of Copper Clad Laminate.
Based on
customers specific needs, we produce common thermal conductivity aluminum(AL M
01) or copper(CU M 01) CCL and high thermal conductivity aluminum (AL H
02~06) or copper (CU H 06) CCL .
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