Glass Substrate For Advanced Semiconductor Packaging - China

Glass Substrate for Advanced Semiconductor Packaging

Glass Circuit supplies precision glass substrates for semiconductor packaging, RF, photonics, MEMS and high-density interconnect development.

As a glass substrate manufacturer focused on advanced packaging, we support wafer and custom-size formats with controlled thickness, flatness, surface quality, thermal expansion and dielectric performance.

For projects that require a customized glass substrate, dimensions, thickness, material properties and downstream processing can be matched to the device architecture and packaging process.

TGV formation, metallization and RDL processing are also available through our related manufacturing capabilities.

Glass Substrate Options

Configuration Typical Requirement

Precision Glass Substrate High-flatness carrier or base substrate for semiconductor and microfabrication processes

Polished Glass Substrate Low surface roughness for lithography, bonding and fine-line processing

TGV-Ready Glass Substrate Prepared for through-glass via formation and vertical interconnection

Customized Glass Substrate Thickness, dimensions and material properties specified for the customer's application

Our glass substrates can be supplied according to the required level of processing:

As a glass substrate manufacturer, Glass Circuit works with semiconductor-grade glass including borosilicate glass and fused silica.

For a custom glass substrate, material selection should be based on CTE, dielectric loss, optical performance, bonding process and operating environment.

Technical Specifications

Parameter Capability

Substrate Thickness 50 μm–2 mm

Standard Size 200 mm / 300 mm; custom large-size panels available

Surface Roughness Ra < 1 nm

TTV < 0.3 μm

CTE 3–5 ppm/°C

Dielectric Loss Df 0.001–0.002 @ 10 GHz

Optical Transmittance >90% for applicable glass grades

Operating Temperature -60°C to +180°C

Actual values depend on the selected glass material, substrate dimensions and processing requirements.

Contact our engineering team to confirm the specification window for your project.

Company Contact:

• Posted By: GLASS CIRCUIT PTE LTD

• Phone: 13725759777

• Address: Room 608, Building B, Dahong High-tech Industrial Park, No. 117, Beiting Road, Houting, Shajing, Bao, shenzhen , guangdong , China

• Email:

• Business Description: Advanced glass substrate supplier specializing in glass wafers, TGV technology, glass core PCB, glass interposers and MEMS glass wafers for semiconductor and advanced packaging applications.