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Non Silicone Putty Gel Xk Gn15 Thermal Interface Conductive - China
price: contact company for price
Introduction
Syringes packaging, automated production, high temperature, non- corrosive to metal, 100% thermal curing putty.
XK- GN series is a high thermal performance Gel , it based on TPR, Filled with a variety of high- performance ceramic powder.
It also has high thermal conductivity, low thermal resistance, good insulation characteristics .
Features
Good compressibility
Non- silicone
Non- curing
Resists pump- out
Applications
Consumer electronics.
Automotive Systems.
Telecommunications.
XK- GN15 / XK- GN20 / XK- GN30 / Method
Thermal Conductivity - - - - - - W/ mK - - - - - 1.4 / 2 / 3 / HOT DISK
Specific Gravity - - - - - - g/ cm3 - - - - - 2.6 / 2.8 / 3 / ASTM D792
Low limit BLT Thickness - - - - - - mm - - - - - 0.05 / 0.05 / 0.08 / ASTM D374
Company Contact:
- Phone: 8675527579310
- Address: Block 45 Baoan Dist, Shenzhen , China
- Email:
- Website: https://www.glpoly.com
Published date: February 2, 2016
- Business Description: Offering Thermal Interface Materials(thermal gap pad, Thermal Grease, Thermal gap filler, Silicone Thermal Tape, Silicone Gel, Non silicone thermal gap filler, silicone free thermal pad, non silicone grease, etc.
We are committed to becoming a leading enterprise in the field of thermal interface materials.
No significant quality complaint for 18 consecutive years.
At Goldlink, developing high quality Thermal Interface Materials and Thermal Solution for electronics industry is our first priority.
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