Silicone Soft Pad Xk P60 Thermal Interface Material Conductive - China

Introduction

This series of products are resilient and with large deformation, suitable for large institutional design tolerances.

Single or Double layer structure, The Double layer is reinforced with special ultra- thin fabric to increase resistance and workability of punching, strip type, Malformation designs.

Self- adhesive and never recede.

No corrosion to the Copper surface, “enviromentally friendly products”.

Features

Ultra conformable, “gel- like” modulus

Designed for low- stress applications

low hardness

Applications

Telecommunications

Computer, Between heat- generating semiconductor and a heat sink

　 unit XK- P12 XK- P15 XK- P25 XK- P30 XK- P45 XK- P50 XK- P60 XK- P80 Method

Reinforcement Carrier With ( F) or Without Fiber Hard Layer ( H) or Without Fiber 　

Inherent Surface Tack 　

Color Gray Green Yellow Light Blue Gray Red Gray light Gray visual

Thickness mm 0.3~3.0 0.3~3.0 0.3~3.0 0.5~2.0 ASTM D374

Specific Gravity g/ cm3 2.12 2.44 2.73 3.1 3.24 3.35 3.45 3.55 ASTM D792

Hardness Asker C 3~4 3~5 15~18 15~20 25~30 25~30 35~40 50 JIS K7312

　 Shore 00 25~35 30~40 40~50 40~50 45~55 45~55 50~60 80 ASTM D2240

Thermal impedance @ 0.5mm 14.5psi ℃in2/ W 0.65 0.59 0.35 0.28 0.26 0.21 0.16 0.13 ASTM D5470

Thermal Conductivity W/ mK 1.2 1.5 2.5 3 4.5 5 6 8 HOT DISK

Volume Resistivity Ωcm ASTM D257

Breakdown Voltage KV/ mm 16 16 16 15 ASTM D149

Dielectric Constant 1 5.2 5.5 6.5 7 8 8 8.5 9 ASTM D150

Application temperature ℃ 　

Tensile strength psi 14 15 13 13 23 12 10 10 ASTM D149

Elongation % 200 130 100 80 50 40 30 20 ASTM D149

Siloxane Volatiles D4~D20 % <0.005 <0.005 <0.003 <0.001 GC- FID

Flammability UL94 UL94

Company Contact:

• Posted By: Shenzhen Goldlink Tongda Electronics Co., Ltd

• Phone: 8675527579310

• Address: Block 45 Baoan Dist, Shenzhen , China

• Email:

• Website: https://www.glpoly.com

• Business Description: Offering Thermal Interface Materials(thermal gap pad, Thermal Grease, Thermal gap filler, Silicone Thermal Tape, Silicone Gel, Non silicone thermal gap filler, silicone free thermal pad, non silicone grease, etc.
  
  We are committed to becoming a leading enterprise in the field of thermal interface materials.
  
  No significant quality complaint for 18 consecutive years.
  
  At Goldlink, developing high quality Thermal Interface Materials and Thermal Solution for electronics industry is our first priority.