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Thermal Conductive Silicone Fiberglass Xk F15 Interface - China

price: contact company for price

Introduction

Unlike traditional low thermal conductivity fiberglass with ceramic powder filler, XK- F series is a composite of high performance ceramic filler and 30um thin fiberglass, achieving high thermal conductivity on flatness surface with low pressure.

Recommended using for TO220/ TO3P where insulation is needed.

Features

Elastomeric compound coated on both sides

No oil bleed, long term stability

Electrical insulating

Applications

Power supplies

Automotive electronics

Motor controls

Power semiconductors

  unit- - - - XK- F15/ XK- F35/ XK- F60 Method

Reinforcement Carrier   Fiberglass/  

Thickness mm- - - - 0.2~0.5/ 0.3 / 0.38/ 0.2~0.5 ASTM D374

Specific Gravity g/ cm3- - - - 2.4/ 1.8/ 1.6 ASTM D792

Hardness Shore A- - - - 80/ 80/ 85ASTM D2240

Thermal impedance ℃in2/ W- - - - 0.48/ 0.2/ 0.16 ASTM D5470

Thermal Conductivity W/ mK- - - - 1.5/ 3.5/ 5.8 HOT DISK

Volume ResistivityΩcm- - - - >1013/ >1013/ >1013 ASTM D257

Breakdown VoltageKV- - - - >3.5/ >4 / >3.5 ASTM D149


Company Contact:


  • Phone: 8675527579310

  • Address: Block 45 Baoan Dist, Shenzhen , China

  • Email: Email


Published date: February 2, 2016

  • Business Description: Offering Thermal Interface Materials(thermal gap pad, Thermal Grease, Thermal gap filler, Silicone Thermal Tape, Silicone Gel, Non silicone thermal gap filler, silicone free thermal pad, non silicone grease, etc.

    We are committed to becoming a leading enterprise in the field of thermal interface materials.

    No significant quality complaint for 18 consecutive years.

    At Goldlink, developing high quality Thermal Interface Materials and Thermal Solution for electronics industry is our first priority.

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