Thermal Conductivity Silicone Putty Pad - China

PRODUCT PROPERTIES

XK- P50- P XK- P80- P unit Test Method

Thickness mm

Color Dard Red gray 　 Visual

Construction Silicone 　

Op.

temp.

range - 45~150 - 45~150 ℃　

Density 3.1 3.3 g/ cm3 ASTM D792

Thermal Conductivity 68 W/ mK ASTM D5470

Breakdown Voltage 13 11 KV/ mm ASTM D149

Volume Resistance Ohm- cm ASTM D257

Total Mass Loss% ASTM E595

Tensile strength psi ASTM D412

Elongation % ASTM D412

Flame Rating V- 0 V- 0 　 UL- 94

REACH/ RoHS CompliantREACH/ RoHS

Thermal properties

　 XK- P50- P XK- P80- P

RA ( Kin2/ W) ( Kin2/ W)

compress30% 0.24 0.18

compress40% 0.22 0.15

compress50% 0.20 0.12

compress70% 0.15 0.11

compress90% 0.12 0.08

Compression Load

　 XK- P50- P XK- P80- P

Pressure( psi) Pressure ( psi)

Compress30% 11 12

Compress40%27 29

Compress50%46 49

Compress70%56 61

Compress90%77 85

Company Contact:

• Posted By: Shenzhen Goldlink Tongda Electronics Co., Ltd

• Phone: 8675527579310

• Address: Block 45 Baoan Dist, Shenzhen , China

• Email:

• Website: https://www.glpoly.com

• Business Description: Offering Thermal Interface Materials(thermal gap pad, Thermal Grease, Thermal gap filler, Silicone Thermal Tape, Silicone Gel, Non silicone thermal gap filler, silicone free thermal pad, non silicone grease, etc.
  
  We are committed to becoming a leading enterprise in the field of thermal interface materials.
  
  No significant quality complaint for 18 consecutive years.
  
  At Goldlink, developing high quality Thermal Interface Materials and Thermal Solution for electronics industry is our first priority.