Industrial Bga Packaging Manufacturer - China

Industrial BGA Packaging Manufacturer

BGA (Ball Grid Array) represents a mainstream integrated circuit packaging technology.

Its core characteristic lies in the substitution of traditional peripheral pins with an array of solder balls positioned at the base of the package.

This configuration confers substantial advantages in terms of high density, enhanced performance, and efficient thermal dissipation.

At our China factory, we specialize in high density BGA NAND and high capacity BGA NAND solutions.

We provide complete BGA IC packaging services, from design and wafer testing to final assembly, helping global clients achieve compact, reliable storage in demanding environments.

Our Industrial BGA Packaging Solutions We manufacture a full range of high reliability BGA packaging products tailored for industrial use.

Our high density BGA NAND modules support capacities from 64GB to 512GB and beyond, using advanced SLC, MLC, or TLC NAND flash.

Key offerings include: High capacity BGA NAND for space-constrained designs Wide temperature BGA solutions operating from -40°C to 85°C or higher Rugged BGA packaging with enhanced vibration and shock resistance Embedded BGA NAND ideal for soldered-down applications All products undergo strict in-house testing to ensure long-term data retention and high program/erase cycles.

Contact us.

Company Contact:

• Posted By: Jiangsu RuiXIN Microelectronics Co., LTD

• Phone: 13662216903

• Address: No. 3, South Side of Bosideng Avenue, Economic Development Zone, Jiangsu, Jiangsu, China

• Email:

• Website: https://www.jsrxw.com/

• Business Description: Our Company was eastablished in November 2021,it is a high-class electronic in-formation manufacturing enterprise focusing on IC packaging and teasting busi-ness(including memory chip,IC packaging,wafer testing service,and chip finished product testing service).