High Performance Glass Wafers Empowering New Heights In Semiconductor Manufacturing - China

Glass Wafers

Our company has introduced equipment such as glass laser cutting machines, ultrasonic instruments, engraving and grinding machines, etc.

At the same time, we have experienced technicians with many years of industry experience, who can provide customers with glass wafers with a thickness of ≥ 0.1mm and an external dimension of ≥ Φ1".

These glass wafers are applied in CMOS, CCD sensors, integrated circuits or MEMS (Micro-Electro-Mechanical Systems), communication and data processing, optics, electronic products, household appliances, military, research and other high-tech products.

Product Features:

Special optical glass materials with excellent heat resistance and light transmission performance, as well as good chemical properties.

Rich experience in glass production and processing, with surface shape accuracy and appearance quality that meet standards.

Customizable thickness and size, with small thickness and size tolerances.

Compliant with conventional processing requirements and industrial standards (such as SEMI).

Integrated production process that meets all requirements of ISO 9001: 2000.

Typical Applications:

Micro-optics

MEMS (pressure sensors, accelerometers.

)

Wafer-level packaging (image sensor packaging.

)

Biotechnology (microfluidics, DNA analysis.

)

And many other customer-specified applications.

Glass Wafer Processing Parameters:

a) Materials: Corning Eagle XG, BOROFLOAT 33, PYREX7740, Gorilla, quartz glass, B270, D263T, AF32, BK-7, K9, etc.

;

b) Standard thickness: 0.1mm, 0.145mm, 0.2mm, 0.21, 0.3mm, 0.5mm, 0.55, 0.7mm, 1.0mm, 1.1mm, 1.5mm, 2.0mm, etc.

(thickness tolerance ± 0.02 - 0.05mm);

c) Standard size: Φ1", Φ2", Φ3", Φ4", Φ5", Φ6", Φ8", Φ12" (other sizes can be customized);

d) Appearance: 60/40; 40/20; 20/10;

e) Alignment method: flat edge/缺口；

f) Surface roughness (Ra) < 1nm；

g) Flatness < 20um；

h) Each edge rounded by 0.05 - 0.2mm；

i) Cracks < 0.2mm, no internal cracks；

j) Surface clean, no marks or stains, dust-free packaging under a clean workbench, special wafer box.

Basic Parameters of Glass Wafers： Technical Specifications:

Transmittance > 90%

TTV/Flatness < 10um

Warp/Bend < 50um

Bow/Warp < 50um

Surface Roughness Ra < 1nm

Fineness 60/40; 40/20; 20/10

Company Contact:

• Posted By: Tihot Optics Co., Ltd.

• Phone: 8613688878943

• Address: Room 303,Building D, No. 39, Ruihe Road,Huangpu District,, Guangzhou , guangdong , China

• Email:

• Website: https://opticalglass.net/

• Business Description: OPTICAL GLASS Manufacturer in China with One-Stop Service
  
  TIHOTOPTICS is one of China’s leading optical glass manufacturers and suppliers.
  
  Providing high-quality glass processing technology and customized solutions