Glass Core Pcb For Advanced Packaging - China

Glass Core PCB for Advanced Packaging and High-Density Interconnects

Glass Circuit develops glass core circuit substrates for advanced semiconductor packaging, high-speed communication, RF and photonic integration.

As a glass core pcb manufacturer, we combine precision glass cores with Through Glass Via (TGV), metallization and fine-line RDL processing to support low-warpage, high-density electrical interconnection.

Our glass core structures can be customized by core thickness, panel size, TGV geometry, circuit pitch and stack design.

For projects requiring a custom glass pcb or multi layer glass pcb, our engineers can review drawings and define the appropriate glass, via and routing structure before prototyping.

Available Glass Core PCB Configurations

TGV Glass Core

Glass core with vertical through-glass vias for high-density I/O and vertical electrical interconnection.

Metallized Glass Core

TGV structures with conductive metallization for reliable vertical electrical connection.

Glass Core with RDL

Fine-line redistribution structures designed for higher routing density and package integration.

Multi-Layer Glass Core PCB

Application-specific multilayer circuit structures developed according to routing and package requirements.

For projects that primarily require processed through-glass vias, see our TGV Glass Wafer.

For high-density die-to-die redistribution, see our Glass Interposer.

Technical Capabilities

Parameter Capability

Core Material High-purity alkali-free glass / borosilicate glass

Substrate Thickness 50 μm–1.5 mm

Panel Size 200 × 200 mm / 300 × 300 mm; custom large-size panels available

TGV Hole Diameter Minimum 3 μm

Maximum Aspect Ratio Up to 100: 1

Surface Roughness Ra < 1 nm

CTE 3–5 ppm/°C

Dielectric Loss Df 0.001–0.002 @ 10 GHz

Wiring Precision Fine line down to 2 μm

Operating Temperature -60°C to +180°C

Board Warpage <0.1%

The achievable combination of TGV diameter, aspect ratio, line width, substrate thickness and panel size depends on the final design.

As a glass core pcb manufacturer, we recommend DFM evaluation before finalizing production specifications.

Company Contact:

• Posted By: GLASS CIRCUIT PTE LTD

• Phone: 13725759777

• Address: Room 608, Building B, Dahong High-tech Industrial Park, No. 117, Beiting Road, Houting, Shajing, Bao, shenzhen , guangdong , China

• Email:

• Business Description: Advanced glass substrate supplier specializing in glass wafers, TGV technology, glass core PCB, glass interposers and MEMS glass wafers for semiconductor and advanced packaging applications.