Hm Pumex Grinding Machine - China
price: contact company for price
Name TSP HM3/6-75 S/Z HM3/6-85 S/Z
Appearance Size L2247mm*W1600mm*H1400士2 5mm
L2887mm*W1600mm*H1400å £«25m L2247mm*W1700mm*H1400士2 5mm
L2887mm*W1700mm*H1400å œŸ25mm
Max HM3/6-75S/Z: 660mm*660mm HM3/6-85 S/Z: 762 mm*762mm
Min 250mm* 250mm
Substrate Thickness 0.2~ 3.2mm /0.5~ 8.0mm
Production Speed 1.5~3.0M/Min adjustable speed range 1.0~5.0M/Min
Total weight of the machine About 1.2T(2-axis)/About 1.6T(4-axis)
Applicable Process Dry Film Pre-treatment, Solder Mask Pre-treatment
Company Contact:
- Posted By: Shenzhen JuYongNeng Technology Co., Ltd
- Phone: +86 755 27372891
- Address: No. 14, Zhengcheng 1st Road, Fuhai Street, Fuyong Town, Bao'an District, Shenzhen , Guangdong , China
- Email:
- Website: https://www.jynpcbm.com/
Published date: June 24, 2025
- Business Description: Shenzhen JuYongNeng Technology Co., Ltd., established in 2003, is a national high-tech enterprise specializing in the R&D, production, and sales of mid-to-high-end wet process equipment for the PCB, semiconductor, and SMT industries.
With a business site of 5,000+ square meters and over 100 employees (including 30+ technical experts), the company is a leader in precision surface treatment solutions.
Headquartered in Shenzhen, it has offices in Huizhou, Kunshan, and Zhuhai, serving clients like Founder Electronics, Flextronics Group, Huatong Computer, and Jiesai Technology.
Related listings
-
Automatic Wafer Cleaning Device After Light ResistanceMachinery - Shenzhen JuYongNeng Technology Co., Ltd - China - June 24, 2025 - contact company for price
Application field: removal of photoresistance/wafer cleaning after grinding Wafer size: 150mm&200mm&300mm (customizable) Process indicators: wafers with processes above 19nm can be cleaned Automatic Wafer Plating Machine features: Equipped wi...
-
Jt Copper Reduction LineMachinery - Shenzhen JuYongNeng Technology Co., Ltd - China - June 24, 2025 - contact company for price
Name TSP Max JT-75: 660 mm*660mm JT-85: 762 mm*762mm Min 220mm*220mm Substrate Thickness 0.05-1.2mm /0.3-6.0mm Applicable Process Copper Reduction after Horizontal ELectrolytic Plating, Copper Reduction after Lamination Characteristic s of JT Copper ...
-
Full Automatic Spring Packaging Machine Zf Th700Machinery - Shenzhen Zhongfu Packaging Technology Co., Ltd - China - June 24, 2025 - contact company for price
Mainly used for organ packaging of textured paper. Full-automatic Spring Packaging Machine can be connected with the automatic slitting machine to form a perfect production line, saving labor costs and improving production efficiency. Packaging speed...
Safe Trade Tips
- Ask for business references and check them
- Use a payment method that offers better protection for all such as Letters of credit and verified professional escrow services. Avoid payments in advance such as money transfers
- Verify their business via their local Chamber of Commerce
- Search the internet using their website address, their business name, their phone and fax numbers, and their email addresses to see if you can find any feedback about them.
- Get to know more about scams and fraud to avoid: Internet Crime Complaint Center - Consumer Financial Protection Bureau
- This site is never involved in any transaction, and does not handle payments, shipping, guarantee transactions, provide escrow services, or offer "buyer protection" or "seller certification"