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Shenzhen JuYongNeng Technology Co., Ltd
- Address: No. 14, Zhengcheng 1st Road, Fuhai Street, Fuyong Town, Bao'an District, Shenzhen, Guangdong , China
- Email:
- Phone: +86 755 27372891
Business description
Shenzhen JuYongNeng Technology Co., Ltd., established in 2003, is a national high-tech enterprise specializing in the R&D, production, and sales of mid-to-high-end wet process equipment for the PCB, semiconductor, and SMT industries.With a business site of 5,000+ square meters and over 100 employees (including 30+ technical experts), the company is a leader in precision surface treatment solutions.
Headquartered in Shenzhen, it has offices in Huizhou, Kunshan, and Zhuhai, serving clients like Founder Electronics, Flextronics Group, Huatong Computer, and Jiesai Technology.
Latest listings
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Hm Pumex Grinding MachineMachinery - Shenzhen JuYongNeng Technology Co., Ltd - China - June 24, 2025 - contact company for priceName TSP HM3/6-75 S/Z HM3/6-85 S/Z Appearance Size L2247mm*W1600mm*H1400士2 5mm L2887mm*W1600mm*H1400 士25m L2247mm*W1700mm*H1400士2 5mm L2887mm*W1700mm*H1400 土25mm Max HM3/6-75S/Z:660mm*660mm HM3/6-85 S/Z:762 mm*762mm Min 250mm* 250mm Substrate Thickne...
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Cjm Ultra Precision Scrubbing MachineMachine Tools - New - Shenzhen JuYongNeng Technology Co., Ltd - China - June 24, 2025 - contact company for priceName TSP CJM2/4-75 S/Z CJM2/4-85 S/Z Appearance Size L1876mm*W1640mm*H1600士2 5mm L2437mm*W1705mm*H1600 士25mm L1876mm*W1705mm*H1600士2 5mm L2437mm*W1640mm*H1600 士25mm Max CJM214-75S/Z: 680mm*680mm CJM2/4-855/Z:762mm*762mm Min 220mm* 220mm Substrate Thi...
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Automatic Wafer Cleaning Device After Light ResistanceMachinery - Shenzhen JuYongNeng Technology Co., Ltd - China - June 24, 2025 - contact company for priceApplication field: removal of photoresistance/wafer cleaning after grinding Wafer size: 150mm&200mm&300mm (customizable) Process indicators: wafers with processes above 19nm can be cleaned Automatic Wafer Plating Machine features: Equipped wi...
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Jt Copper Reduction LineMachinery - Shenzhen JuYongNeng Technology Co., Ltd - China - June 24, 2025 - contact company for priceName TSP Max JT-75: 660 mm*660mm JT-85: 762 mm*762mm Min 220mm*220mm Substrate Thickness 0.05-1.2mm /0.3-6.0mm Applicable Process Copper Reduction after Horizontal ELectrolytic Plating, Copper Reduction after Lamination Characteristic s of JT Copper ...
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Smt Reflow Ovens With Square Tower Tf2 FManufacturer Representatives - Shenzhen JuYongNeng Technology Co., Ltd - China - June 24, 2025 - contact company for priceSurface Mount Reflow Ovens are essential tools in modern electronics manufacturing, ensuring high precision and efficiency in soldering processes. These ovens are engineered to provide uniform heat distribution, precise control, and reliability in ha...
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