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bf33 glass silicon wafer bonding 0mm Photos Catalog - WorldBid B2B Market
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Bf33 Glass Silicon Wafer Bonding Material 0 7 1 0mmLenses / Optical Components - GuangZhou Lighting Glass Co.,Ltd. - China - February 26, 2025 - contact company for priceBF33 Glass, available in thicknesses of 0.7mm and 1.0mm, is a high-quality optical glass designed for silicon wafer bonding applications. This glass offers excellent thermal stability, low thermal expansion, and high transparency, making it an ideal ...
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Schott Borosilicate Glass Anti Scratch 1150 850mm For Silicon Wafer BondingLenses / Optical Components - GuangZhou Lighting Glass Co.,Ltd. - China - February 26, 2025 - contact company for priceSCHOTT Borosilicate Glass Anti-Scratch, measuring 1150*850mm, is a high-quality glass designed specifically for silicon wafer bonding applications. This borosilicate glass offers excellent thermal stability, low thermal expansion, and high chemical r...
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Single Crystal Silicon Bonding WaferComponents - Other - Western Minmetal (SC) Corporation - China - August 14, 2014 - contact company for priceNo. Item Standard Specification 1 Diameter 2” 4” 2 Conductivity Type P/ Boron, N/ Phosphorus 3 Resistivity Ω . cm ≤ 0.0015 4 Diameter mm 50.8±0.2 100±0.3 5 Thickness μ m 425±25 625±25 6 Orientation 7 Primary length mm 16±1 32±2 8 TTV/...
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Cz Fz Diode Silicon WaferComponents - Other - Western Minmetal (SC) Corporation - China - August 14, 2014 - contact company for priceNo. Item Standard Specification 1 Diameter3” 4” 2 Conductivity Type 3 Growth method 4 Resistivity Ω . cm 5 Diameter mm 76.2±0.3 100±0.5 6 Thickness μ m 7 Orientation 8 TTV μ m 9 Bow/ Warp μ m 10 RRV % 11 Oxygen a/ cm3 12 Carbon a/...
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Fz Single Crystal Silicon WaferComponents - Other - Western Minmetal (SC) Corporation - China - August 14, 2014 - contact company for priceNo. Item Standard Specification 1 Diameter mm 53- 150±0.2( 2” 3” 4” 5” 6”) 2 Conductivity Type P/ Boron, N/ Phosphorus 3 Resistivity Ω . cm 10- 150 or as required 4 Orientation 5 Thickness μ m 6 Oxygen ppam 7 Carbon ppam 8 TTV/ TIR μ m...
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Monocrystal Silicon Solar WaferComponents - Other - Western Minmetal (SC) Corporation - China - August 14, 2014 - contact company for priceNo. Item Standard specification 1 Wafer Square Side 125x125±0.5mm 156x156±0.5 mm 2 Diagonal Length 150±0.5mm 200±0.5mm 3 Growth Method CZ CZ 4 Conductivity Type 5 Shape Wafer 6 Surface Orientation 7 Dislocation 8 Resistivity 9 Lifetime 10 Carbon Cont...
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Cz Single Crystal Silicon WaferComponents - Other - Western Minmetal (SC) Corporation - China - August 14, 2014 - contact company for priceNo. Item Standard Specification 1 Diameter 2” 3” 4” 6” 8” 2 Conductivity Type P/ Boron, N/ Phosphorus 3 Orientation <110>±1° , <100>±1° 4 Diameter mm 50.8±0.2 76.2±0.2 100±0.3 154±0.3 200±0.3 5 Thickness μ m 180- 1000 6 Resistivity &...
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Acoustic Devices On Silicon WaferGeneral Electronics - Jinan Jingzheng Electronics Co., Ltd. - China - March 30, 2013 - contact company for price
The need for high-frequency, wide-band filters has instigated many developments based on combining thin piezoelectric films and high acoustic velocity materials to ease the manufacture of devices operating above 2 GHz. In the present work, a technolo...
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Cz Fz Diode Grade Silicon WaferComponents - Other - Western Minmetal (SC) Corporation - China - May 30, 2014 - contact company for priceConductivity: N type or P type Orientation: <100> +/ - 1 degree Resistivity: 5- 100 RRV: 10% , 12% or 25% Diameter: 3”4” 5” Thickness: ( 200- 600) +/ - 5µm Primary Flat: <110>+/ - 1º Length 32.5+/ - 1.5mm Secondary Flat: 180 degree from p...
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Fz Single Crystal Silicon Wafer 2 Inch 3 4 6 8Components - Other - Western Minmetal (SC) Corporation - China - December 24, 2017 - 1.00 Dollar US$FZ Single Crystal Silicon Wafer 2" 3” 4” 5" 6” at Western Minmetals (SC) Corporation Diameter: 2"3"4”5”6” Conducti vity Type: N type or P type Crystal Orientation: <100>, <111> Resistivity: 10-150 Ohm.cm RRV: 20% 25% max Thickness: 325, 3...
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Mcz Single Crystal Silicon WaferComponents - Other - Western Minmetal (SC) Corporation - China - August 14, 2014 - contact company for priceNo. Item Standard Specification 1 Diameter mm 76.2- 200 ( 3” 4” 5’ 6” 8”) 2 Conductivity Type P/ Boron, N/ Phosphorus 3 Orientation <100>, <110>, <111> 4 Thickness μ m 180- 1000±20, or as customer required 5 Resistivity Ω ...
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Fz Ntd Single Crystal Silicon WaferComponents - Other - Western Minmetal (SC) Corporation - China - August 14, 2014 - contact company for priceNo. Item Standard Specification 1 Diameter 2” 3” 4” 5” 6” 2 Conductivity Type P/ Boron, N/ Phosphorus 3 Orientation <100><111>±2 ° 4 Thickness μ m 200- 2000( ±5 or ±10) 5 Resistivity Ω . cm 15- 600 6 RRV % ≤ 8 ≤ 10 &...
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Silicon Wafer Back Grinding WheelsEquipment - Abrasives - more super hard product comapny - China - April 17, 2018 - 1.00 Dollar US$Silicon wafer back grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer. Coolant: Oil, emulsion workpiece processed: silicon wafer of discrete devices, integrated chips (IC) and virgin, ATM, Melchiorre, Peter Wolter...
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Silicon Wafer Back Diamond Grinding WheelEquipment - Abrasives - more super hard product comapny - China - April 24, 2018 - 1.00 Dollar US$Thinning or back grinding wheel Silicon Wafer Back-side Diamond Grinding Wheel Back Grinding W heels for GaN Wafer Silicon wafer back grinding wheels back grinding Wheel for inserts Silicon wafer back grinding wheels are mainly used for the thinning ...
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Back Thinning Grinding Wheel For Silicon WaferCutting Tools - more super hard product comapny - China - April 24, 2018 - 1.00 Dollar US$Thinning or back grinding wheel Silicon Wafer Back-side Diamond Grinding Wheel Back Grinding W heels for GaN Wafer Silicon wafer back grinding wheels back grinding Wheel for inserts Silicon wafer back grinding wheels are mainly used for the thinning ...
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Silicon Wafer Back Side Diamond Grinding WheelEquipment - Abrasives - more super hard product comapny - China - April 17, 2018 - 1.00 Dollar US$Back Grinding Wheels Back Grinding Wheels Are Used For The Thinning And Fine Grinding Of The Silicon Wafer. Name: Diamond Backgrinding Wheel Application: Silicon WaferDiamond Back Grinding Wheels Are Used For Silicon Wafer Grinding. Our Advanced Tech...
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Compact Desktop Spin Coater With Ptfe Chamber For Silicon Wafer CoatingEquipment - Scientific - Zhengzhou CY Scientific Instrument Co., Ltd. - China - July 16, 2020 - 2300.00 Dollar US$This type of spin coater is designed small, and the whole body adopts aluminum alloy structure. The upper cover of the chamber is made of PTFE, and the appearance is beautiful and firm. The spin coater adopts advanced precision motor, the maximum spe...
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Schott Robax Crystalline Glass Tawny Transparent 4 0 5 0mm 1954 1100mm FireplacceLenses / Optical Components - GuangZhou Lighting Glass Co.,Ltd. - China - February 26, 2025 - contact company for priceSchott Robax Crystalline Glass is a high-performance glass designed for use in fireplace applications. Available in thicknesses of 4.0mm and 5.0mm with dimensions of 1954*1100mm, this tawny transparent glass is specifically engineered to withstand hi...
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Lcd Screen Bonding Cog Machine Xcg73 A1 To Bondidng Driver Ic Glass During Panel RepairMachinery - Glassworking - Shenzhen SUNSOM Automation Equipment Co., Ltd. - China - October 27, 2014 - contact company for price
1、 The definition of COG bonding machine（ pre- press） XCG73- A1 : COG bonding equipment ( Preload) referred to as ' bonding machine, ' ' hot- press' , COG bonding equipment is to determine the IC chip on top of LCD glass finishin...
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Corning Gorilla Glass Wafer Tgv 3d Packaging SubstrateLenses / Optical Components - GuangZhou Lighting Glass Co.,Ltd. - China - February 26, 2025 - contact company for priceCorning Gorilla Glass Wafer, specifically designed for TGV (Through Glass Via) and 3D packaging substrates, is a highly durable, scratch-resistant glass ideal for advanced electronic packaging applications. Known for its exceptional strength, lightwe...