Tgv Glass Wafer Manufacturer - China

TGV Glass Wafer Manufacturer | Through Glass Via (TGV) Glass Wafers

TGV Glass Wafer for Advanced Packaging and Vertical Interconnects

Glass Circuit develops precision tgv glass wafer solutions for semiconductor packaging, RF, photonics and MEMS applications.

As a tgv glass manufacturer, we support customized Through Glass Via structures with controlled wafer thickness, via geometry, metallization and copper filling.

Our through glass via wafers can be supplied at different processing stages, from precision TGV formation to metallized and Cu-filled vertical interconnects.

For designs requiring additional redistribution wiring, TGV wafers can be further integrated into a Glass Interposer.

Available TGV Glass Wafer Configurations

TGV-Formed Glass Wafer

Precision through-glass vias with customized via pattern and geometry, supplied before conductive metallization.

Metallized TGV Wafer

TGV sidewalls with conductive metallization for vertical electrical interconnection.

Cu-Filled TGV Wafer

Copper-filled through-glass vias with planarization for applications requiring solid vertical electrical connections.

Custom TGV Wafer

Project-specific glass, thickness, via diameter, pitch, layout and downstream processing according to device requirements.

If your project only requires a precision glass base before TGV processing, see our Glass Substrate.

TGV Glass Wafer Technical Capabilities

Parameter Capability

Glass Material Alkali-free glass / fused silica; project-specific options

Wafer Thickness 50 μm–1.5 mm

Surface Roughness Ra <1 nm

TTV <0.3 μm

CTE 3–5 ppm/°C

Dielectric Loss Df 0.001–0.002 @ 10 GHz

Advanced TGV Aperture Down to 3 μm*

Advanced Aspect Ratio Up to 150: 1*

Via Filling Copper filling available

Planarization CMP available

Via Void Rate <1% under applicable process conditions

As a tgv glass manufacturer, Glass Circuit evaluates via geometry together with wafer thickness and downstream metallization rather than treating each specification independently.

TGV Geometry and Metallization Options

For a custom tgv glass wafer, the following parameters can be defined according to the device and package architecture:

- Via diameter and aspect ratio

- Via pitch and array layout

- Via profile and opening geometry

- Wafer thickness and dimensions

- TGV metallization

- Copper filling

- CMP planarization

- Additional RDL processing

Via position, tolerance and achievable geometry depend on the design.

Submit your CAD drawing or via map for engineering review.

For detailed information about via formation, seed-layer deposition, copper plating and related processing, see our TGV Technology.

Company Contact:

• Posted By: GLASS CIRCUIT PTE LTD

• Phone: 13725759777

• Address: Room 608, Building B, Dahong High-tech Industrial Park, No. 117, Beiting Road, Houting, Shajing, Bao, shenzhen , guangdong , China

• Email:

• Business Description: Advanced glass substrate supplier specializing in glass wafers, TGV technology, glass core PCB, glass interposers and MEMS glass wafers for semiconductor and advanced packaging applications.