6 Russia 
4 India 
3 China 
1 Hong Kong 
1 Germany 
1 Japan 
1 France 
1 Romania 
1 Belgium 
bga pcb assembly smtand dip Photos Catalog - page 4 - WorldBid B2B Market
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Sell Xilinx Bga Hard To Find And ObsoleteComponents - Other - Hard Find Electronics LTD - China - October 13, 2020 - contact company for priceXC6VLX130T-1FFG484I Xilinx XC5VLX50T-1FFG665C Xilinx XC7K325T-2FFG900I Xilinx XCZU9EG-2FFVB1156I Xilinx For more part numbers please contact us. Hard Find Electronics LTD. is an independent distributor of electronic components, especially the hard-to...
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Bga Solder BallMetal Manufacturing - Qingdao StarGood Nonferrous Metal Co., Ltd. - China - July 6, 2022 - 50000.00 Dollar US$BGA Solder Ball Product: Solder Ball Product composition: tin 99.3 copper 0.7 Product size: 13mm 19mm 22mm customizable Product weight: can be customized Solder balls are electrically conductive by using a heating tool to firmly bond two or more meta...
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Mechanic Soldering Iron Tip For Iphone Bga Motherboard Welding RepairLivestock - Shenzhen PHONEFIX technology Co.,Ltd - China - September 2, 2023 - 2.00 Dollar US$Mechnaic soldering iron tips 900M-T-TIS 900M-T-TI for soldering repair. Mechanic Special Phone BGA Jumper Wire Soldering Iron Tips for iPhone Motherboard Fingerprint Welding Repair Tool. Option Type: Option 1: 900M-T-TIS - Curved Tip Option 2: 900M-T...
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Pure Copper Desoldering Wick Bga Solder Wire For Phone SolderingGeneral Agriculture - Shenzhen PHONEFIX technology Co.,Ltd - China - September 19, 2023 - 1.00 Dollar US$99.9% pure copper BGA desoldering wire for mobile phone motherboard repair, sucking line BGA tin absorbtion line, absorption wire soldering accessory assistant for removes unwanted solder quickly, desoldering wire solder wick except for the tin absor...
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Sucking Tin Wire 3 5mm 1 5m Bga Desoldering BraidFlowers - Dried - Shenzhen PHONEFIX technology Co.,Ltd - China - September 20, 2023 - contact company for priceSucking Tin absorption wire for the tin absorbing excess solder, sucking tin absorption line for mobile phone motherboard repair tool, CP-3515/3015/2015/2515/15 15 BGA desoldering braid solder remover wick except for the tin absorbing excess solder. ...
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Aifen A11 Usb Soldering Iron With C210 Tip Welding Handle Cpu Bga Smd RepairEquipment - Welding - Shenzhen weikexiu technology - China - June 5, 2024 - 42.99 Dollar US$AIFEN A11 Portable USB Soldering Iron compatible with C210 soldering iron tips for daily welding repair, such as mobile phone motherboard CPU BGA SMD chip soldering, etc. AIFEN A11 rechargeable soldering iron with USB Type-C charging port and 75W hig...
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Qianli And Ycs R1 1000w Hot Air Gun Intelligent Bga Rework StationConstruction - Electrical - Shenzhen weikexiu technology Co.,Ltd - China - August 12, 2024 - 119.99 Dollar US$YCS R1 Smart Hot Air Gun 1000W High Power BGA Soldering Rework Station for Mobile Phone PCB Chip Repair. The YCS R1 hot air gun is equipped with 4 nozzles and can be used for soldering and desoldering BGA SMD chips of various electronic products, suc...
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Kaisi Lcd Screen Ic Bga Reballing Stencil For Iphone 11 14 Pro MaxGeneral Electronics - PHONEFIX technology Co.,Ltd - China - August 15, 2024 - 2.29 Dollar US$Description Kaisi BGA Reballing Stencil steel net for iPhone LCD display screen IC soldering repair. Kaisi 6 in 1 screen IC stencil for iPhone 11-14Pro Max screen repair. Package includes: 1 x 6 in 1 BGA Reballing Stencil
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Rf4 0 3 1 0mm Sn63% Rosin Core Tin Solder Wire For Phone Bga RepairElectronics - Manufacturing - PHONEFIX technology Co.,Ltd - China - August 20, 2024 - 6.55 Dollar US$Description RF4 RF-106A 0.6mm 108A RF-0.8mm 100g / RF-203D 0.3mm RF-204D 0.4mm RF-206D 0.6mm RF-208D 0.8mm RF-210D 1.0mm 200g Sn63% Lead-Free Rosin Core Solder Tin Wire. RF4 BGA desoldering wire for mobile phone motherboard SMD PCB welding repair too...
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Silver Bga Reballing Stencil Template For Iphone 6 15 Pro MaxComponents - Other - Shenzhen PHONEFIX technology Co.,Ltd - China - October 22, 2024 - 0.99 Dollar US$DIYPHONE 0.12mm silver BGA reballing steel stencil template for iPhone 6-15 Pro Max. High-quality silver stencil net BGA reballing stencils steel stencil templates for iPhone motherboard chips soldering repair. Option: Option 2: For iPhone 6/6P. Opti...
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Xzz C1 With Bga Ic Tin Planting Silicone PadGeneral Electronics - PHONEFIX technology Co.,Ltd - China - December 5, 2024 - 8.95 Dollar US$Features: 1. The slope design allows for better chip fit, is compatible with thinner chip ICs, and the pads are not suspended and are more uniform. 2. Strong magnetic properties and stable chip steel mesh. Paired with the Xinzhizao C4 base, the magne...
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Rf Fx35a 7 50x Trinocular Stereo Microscope For Bga Chip RepairMobile Phones - Accessories - China PHONEFIX Technology Co., Ltd, - China - December 13, 2024 - 205.00 Dollar US$Description RF4 RF-FX35A 7-50X Trinocular Stereo Microscope with 370mm swing stand and RF-P016 large silicone soldering pad for mobile phone PCB circuit board CPU BGA chip welding and repair. RF4 RF-FX23A Trinocular microscope with 330mm swing bracke...
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Amaoe Series Bga Reballing Stencil Soldering Steel MeshMobile Phones - Accessories - China PHONEFIX Technology Co., Ltd, - China - December 26, 2024 - 2.50 Dollar US$Description AMAOE SF1 0.12mm BGA Reballing Stencil Comprehensive Tin Planting Net for Microsoft Surface Chips soldering repair. Amaoe Surface Pro X CPU SQ2 Stencil Steel Mesh 52*60mm. AMAOE EC chip MRT633SFF0B reballing stencil for Surface Pro 7+/8/9...
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Uowei Lw Pt03 Intelligent Efficient Bga Cpu Ball Soldering PlatformMobile Phones - Accessories - China PHONEFIX Technology Co., Ltd, - China - January 1, 2025 - 7.50 Dollar US$Description LUOWEI LW-PT03 LW-PT02 CPU Chip Tin Planting Platform with Heat-resistant Silicone Pad for Electronics/Mobile Phone BGA Chips Soldering Repair. Anti-slip, no bulging, high temperature resistant. Luowei multi-function BGA reballing magneti...
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Maant Bga Lead Free Repair Flux Solder PasteAutomobiles - Used - China PHONEFIX Technology Co., Ltd, - China - January 21, 2025 - 1.95 Dollar US$Description MaAnt UP-79 MY-224 MY-225 halogen-free solder paste for mobile phone/electronic circuit board CPU BGA chip soldering desoldering repair. MaAnt 10cc high insulation resistance soldering paste flux for electronic component chip tinning and ...
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Thermal Imager Analyzer For Mobile Phone Motherboard Bga Fault DetectionElectronics Testing - Shenzhen weikexiu technology Co.,Ltd - China - March 20, 2025 - 205.99 Dollar US$
Description WXY P20R 512x384 high resolution thermal camera analyzer 256*192 high definition thermal imaging for mobile phone motherboard BGA fault rapid detection. WXY HM-TJ32-7RF thermal camera equipped with +/-2 and +/-4 temperature control detect...
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Aixun H414d 1400w Dual Hot Air Gun Bga Rework StationAutomobile - Filters - China PHONEFIX Technology Co., Ltd, - China - May 22, 2025 - 310.00 Dollar US$Description AIXUN H414D 1400W Dual Station Hot Air Gun BGA Rework Station for Mobile Phone Repair. AiXun H414D dual-channel hot air rework station has a built-in 3.5-inch IPS screen. The handle with three buttons can quickly adjust the status and par...
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Nano Flux Mobile Phone Motherboard Bga Chip Welding ToolHand Tools - Shenzhen weikexiu technology Co.,Ltd - China - May 28, 2025 - 2.55 Dollar US$Description Mechanic M35 10CC Nano Flux Paste for mobile phone motherboard BGA chip soldering repair. Mechanic M35 nano flux paste adopts environmentally friendly imported formula, 98% new high activity, high efficiency and synergistic formula, top 6...
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Jtx Jt 6 Bga Soldering Test Practice BoardAutomobile - Accessories - Cleaning / Waxing - China PHONEFIX Technology Co., Ltd, - China - July 1, 2025 - 1.50 Dollar US$Description JTX JT-6 Micro Soldering Test Practice Board used for Mobile Phone Repair Skills Training. Such as chip disassembly, jumper soldering, FPC connector disassembly, BGA soldering training, and test soldering iron, solder paste, solder wire a...
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Industrial Bga Packaging ManufacturerCivil Engineering - Jiangsu RuiXIN Microelectronics Co., LTD - China - July 9, 2026 - 1.00 Dollar US$Industrial BGA Packaging Manufacturer BGA (Ball Grid Array) represents a mainstream integrated circuit packaging technology. Its core characteristic lies in the substitution of traditional peripheral pins with an array of solder balls positioned at t...