Custom Glass Interposer Manufacturer - China

Custom Glass Interposer Manufacturer | Fine Pitch Glass Interposer Solutions

Glass Interposer for Fine-Pitch Advanced Packaging

Glass Circuit develops TGV-enabled glass interposers for Chiplet, 2.5D heterogeneous integration, AI/HPC, RF and photonic packaging.

As a custom glass interposer manufacturer, we combine precision glass substrates, Through Glass Via (TGV) interconnection and fine-line RDL routing to create high-density die-to-die and die-to-package interconnect platforms.

A fine pitch glass interposer can be customized by glass type, thickness, TGV geometry, routing pattern and electrical requirements.

Projects can progress from DFM review and prototype development to pilot and volume manufacturing.

Glass Interposer Configurations

TGV + RDL Glass Interposer

Vertical TGV interconnection combined with redistribution routing for advanced package integration.

Fine-Pitch Glass Interposer

High-density routing structures designed for compact die interfaces and fine-pitch package connections.

High-Frequency Glass Interposer

Low-loss interconnect structures for RF, mmWave and high-speed signal transmission.

Photonic Glass Interposer

Glass-based electrical interconnection designed for optical engines, silicon photonics and CPO integration.

Custom Glass Interposer

Project-specific TGV, RDL, pad layout, substrate geometry and electrical interface design.

If your project requires through-glass vias before redistribution routing, see our TGV Glass Wafer.

For package structures using glass as the structural core, see our Glass Core PCB.

Typical Glass Interposer Structure

A glass interposer combines vertical and lateral electrical routing in one precision platform:

RDL layer count, routing architecture, copper structure and top/bottom interface design are defined according to the package layout and manufacturability review.

Technical Capabilities

Parameter Capability

Base Material High-purity alkali-free glass / low-loss fused silica

Interposer Thickness 50 μm–2 mm

Wafer Format 200 mm / 300 mm; custom panel formats available

Surface Roughness Ra <1 nm

TTV <0.3 μm

CTE 3–5 ppm/°C

Dielectric Loss Df 0.001–0.002 @ 10 GHz

Advanced TGV Aperture Down to 3 μm*

Advanced TGV Aspect Ratio Up to 150: 1*

Via Filling Copper filling available

Via Void Rate <1% under applicable process conditions

Advanced RDL Line/Space Down to 2 μm*

Operating Temperature -60°C to +180°C

Optical Transmittance >90% for applicable optical-grade glass

As a custom glass interposer manufacturer, Glass Circuit evaluates TGV and RDL requirements as an integrated structure rather than as independent minimum dimensions.

TGV and Fine-Pitch RDL Design

For a fine pitch glass interposer, the following parameters can be customized according to the package architecture:

- TGV diameter, pitch and array

- Via metallization and copper filling

- Interposer dimensions and thickness

- RDL line/space and routing pattern

- RDL layer requirements

- Signal, power and ground routing

- Pad layout and interface pitch

- Surface treatment

- Optical requirements where applicable

Detailed TGV formation, metallization and copper processing are available through our TGV Technology capabilities.

Company Contact:

• Posted By: GLASS CIRCUIT PTE LTD

• Phone: 13725759777

• Address: Room 608, Building B, Dahong High-tech Industrial Park, No. 117, Beiting Road, Houting, Shajing, Bao, shenzhen , guangdong , China

• Email:

• Business Description: Advanced glass substrate supplier specializing in glass wafers, TGV technology, glass core PCB, glass interposers and MEMS glass wafers for semiconductor and advanced packaging applications.