Mems Glass Wafer Manufacturer - China

MEMS Glass Wafer Manufacturer | Optical MEMS Glass Wafer Solutions

1 - Product Introduction

MEMS Glass Wafer is a high-precision, ultra-stable specialized glass wafer tailor-made for MEMS micro-electromechanical systems, micro-nano sensors and microfluidic chip devices.

Adopting high-purity borosilicate glass, alkali-free glass and fused silica glass as core base materials, and integrated with proprietary femtosecond laser micro-nano processing, precision etching and nano surface shaping technologies, the product features ultra-low thermal deformation, excellent chemical inertness, superior air tightness and ultra-high surface flatness.

Different from conventional silicon wafers and ordinary glass wafers, MEMS Glass Wafer is perfectly compatible with core MEMS manufacturing procedures, including anodic bonding, wafer-level packaging, micro-cavity etching and vacuum sealing.

It effectively solves typical industry pain points of traditional MEMS substrates, such as poor dimensional stability, susceptibility to corrosion, high residual stress and low bonding yield.

Capable of monolithic integration of micro-channels, micro-cavities, TGV vertical interconnections and optical functional structures, it serves as the core carrier for high-precision inertial sensors, pressure sensors, optical MEMS and biomedical micro-devices, supporting miniaturization, high stability and long-life batch manufacturing of next-generation MEMS systems.

2 - Core Advantages

● Ultra-low and matched thermal expansion: Maintains a stable CTE of 3~5 ppm/℃, achieving precise thermal matching with silicon MEMS chips to eliminate thermal drift and ensure long-term measurement stability of high-precision sensors

● Excellent chemical inertness: Delivers outstanding acid and alkali corrosion resistance and solvent resistance with zero ion precipitation, adapting to diverse MEMS etching and wet cleaning processes without structural damage or contamination

● Nano-level ultra-flat & low-stress surface: Features nano-scale surface flatness and ultra-low residual stress, effectively preventing structural deformation of micro-nano cavities and microfluidic channels during processing and service

● Superior anodic bonding performance: Ensures high bonding strength and zero air leakage, significantly improving wafer-level packaging yield and hermetic sealing reliability

● High vacuum tightness & moisture resistance: Provides reliable vacuum air tightness and damp-proof performance, ideal for long-term stable operation of vacuum MEMS resonant cavities and precision sealed micro-devices

● High insulation & low dielectric loss: Possesses excellent electrical insulation and ultra-low high-frequency loss, reducing signal interference and effectively improving the signal-to-noise ratio of MEMS sensing devices

● Flexible micro-nano structure processing capability: Supports precision fabrication of micro pits, micro grooves, microfluidic channels and high-density TGV via arrays to meet diversified MEMS structural design demands

● High optical performance: Offers high light transmittance and ultra-low optical distortion, fully compatible with optical MEMS, laser sensing and micro-optical system integration scenarios

● Long-term structural reliability: Excellent anti-aging and fatigue resistance, fully meeting high-reliability service requirements of aerospace, automotive and industrial-grade MEMS devices

Company Contact:

• Posted By: GLASS CIRCUIT PTE LTD

• Phone: 13725759777

• Address: Room 608, Building B, Dahong High-tech Industrial Park, No. 117, Beiting Road, Houting, Shajing, Bao, shenzhen , guangdong , China

• Email:

• Business Description: Advanced glass substrate supplier specializing in glass wafers, TGV technology, glass core PCB, glass interposers and MEMS glass wafers for semiconductor and advanced packaging applications.