3 China 
3 Singapore 
2 UK 
1 Germany 
bga irda weldert890 Photos Catalog - page 4 - WorldBid B2B Market
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Silver Bga Reballing Stencil Template For Iphone 6 15 Pro MaxComponents - Other - Shenzhen PHONEFIX technology Co.,Ltd - China - October 22, 2024 - 0.99 Dollar US$DIYPHONE 0.12mm silver BGA reballing steel stencil template for iPhone 6-15 Pro Max. High-quality silver stencil net BGA reballing stencils steel stencil templates for iPhone motherboard chips soldering repair. Option: Option 2: For iPhone 6/6P. Opti...
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Ycs Solder Paste 138 150 183 199 215℃ Pcb Bga Cpu Tin Planting FluxGeneral Electronics - PHONEFIX technology Co.,Ltd - China - October 23, 2024 - 3.59 Dollar US$Features: 1. YCS high-quality high temperature, medium temperature and low temperature solder paste is suitable for BGA, IC, CPU and PCB precision soldering repair. 2. Excellent anti-oxidation performance, uniform and delicate. Strong wettability, ex...
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Xzz C1 With Bga Ic Tin Planting Silicone PadGeneral Electronics - PHONEFIX technology Co.,Ltd - China - December 5, 2024 - 8.95 Dollar US$Features: 1. The slope design allows for better chip fit, is compatible with thinner chip ICs, and the pads are not suspended and are more uniform. 2. Strong magnetic properties and stable chip steel mesh. Paired with the Xinzhizao C4 base, the magne...
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Ycs Solder Paste 150 183 199℃ Smd Pcb Bga Repair Syringe FluxGeneral Electronics - PHONEFIX technology Co.,Ltd - China - December 8, 2024 - 1.99 Dollar US$YCS Needle Tube Solder Paste 150℃ 183℃ 199℃ Syringe Flux for mobile phone motherboard PCB BGA SMD chip soldering repair. Strong conductivity, high density, high resistance, and strong welding force. Option: 1. YCS 150℃ syringe solder paste 35g. 2. YC...
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Rf Fx35a 7 50x Trinocular Stereo Microscope For Bga Chip RepairMobile Phones - Accessories - China PHONEFIX Technology Co., Ltd, - China - December 13, 2024 - 205.00 Dollar US$Description RF4 RF-FX35A 7-50X Trinocular Stereo Microscope with 370mm swing stand and RF-P016 large silicone soldering pad for mobile phone PCB circuit board CPU BGA chip welding and repair. RF4 RF-FX23A Trinocular microscope with 330mm swing bracke...
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Amaoe Series Bga Reballing Stencil Soldering Steel MeshMobile Phones - Accessories - China PHONEFIX Technology Co., Ltd, - China - December 26, 2024 - 2.50 Dollar US$Description AMAOE SF1 0.12mm BGA Reballing Stencil Comprehensive Tin Planting Net for Microsoft Surface Chips soldering repair. Amaoe Surface Pro X CPU SQ2 Stencil Steel Mesh 52*60mm. AMAOE EC chip MRT633SFF0B reballing stencil for Surface Pro 7+/8/9...
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Uowei Lw Pt03 Intelligent Efficient Bga Cpu Ball Soldering PlatformMobile Phones - Accessories - China PHONEFIX Technology Co., Ltd, - China - January 1, 2025 - 7.50 Dollar US$Description LUOWEI LW-PT03 LW-PT02 CPU Chip Tin Planting Platform with Heat-resistant Silicone Pad for Electronics/Mobile Phone BGA Chips Soldering Repair. Anti-slip, no bulging, high temperature resistant. Luowei multi-function BGA reballing magneti...
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Maant Bga Lead Free Repair Flux Solder PasteAutomobiles - Used - China PHONEFIX Technology Co., Ltd, - China - January 21, 2025 - 1.95 Dollar US$Description MaAnt UP-79 MY-224 MY-225 halogen-free solder paste for mobile phone/electronic circuit board CPU BGA chip soldering desoldering repair. MaAnt 10cc high insulation resistance soldering paste flux for electronic component chip tinning and ...
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Thermal Imager Analyzer For Mobile Phone Motherboard Bga Fault DetectionElectronics Testing - Shenzhen weikexiu technology Co.,Ltd - China - March 20, 2025 - 205.99 Dollar US$
Description WXY P20R 512x384 high resolution thermal camera analyzer 256*192 high definition thermal imaging for mobile phone motherboard BGA fault rapid detection. WXY HM-TJ32-7RF thermal camera equipped with +/-2 and +/-4 temperature control detect...
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Spiral Hot Air Desoldering Station For Pcb Cpu Bga Welding RepairEquipment - Electrical - Shenzhen weikexiu technology Co.,Ltd - China - March 31, 2025 - 62.99 Dollar US$Description FORWARD FW-HA01 FW-HA02 FW-HA03 FW-HA04 FW-HA05 Helical Wind Desoldering Station 800W Hot Air Gun with Nozzles for mobile phone motherboard and electronic PCB CPU BGA soldering repair. Fast heating, precise temperature control, efficient ...
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Aixun H414d 1400w Dual Hot Air Gun Bga Rework StationAutomobile - Filters - China PHONEFIX Technology Co., Ltd, - China - May 22, 2025 - 310.00 Dollar US$Description AIXUN H414D 1400W Dual Station Hot Air Gun BGA Rework Station for Mobile Phone Repair. AiXun H414D dual-channel hot air rework station has a built-in 3.5-inch IPS screen. The handle with three buttons can quickly adjust the status and par...
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Nano Flux Mobile Phone Motherboard Bga Chip Welding ToolHand Tools - Shenzhen weikexiu technology Co.,Ltd - China - May 28, 2025 - 2.55 Dollar US$Description Mechanic M35 10CC Nano Flux Paste for mobile phone motherboard BGA chip soldering repair. Mechanic M35 nano flux paste adopts environmentally friendly imported formula, 98% new high activity, high efficiency and synergistic formula, top 6...
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Jtx Jt 6 Bga Soldering Test Practice BoardAutomobile - Accessories - Cleaning / Waxing - China PHONEFIX Technology Co., Ltd, - China - July 1, 2025 - 1.50 Dollar US$Description JTX JT-6 Micro Soldering Test Practice Board used for Mobile Phone Repair Skills Training. Such as chip disassembly, jumper soldering, FPC connector disassembly, BGA soldering training, and test soldering iron, solder paste, solder wire a...
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Industrial Bga Packaging ManufacturerCivil Engineering - Jiangsu RuiXIN Microelectronics Co., LTD - China - July 9, 2026 - 1.00 Dollar US$Industrial BGA Packaging Manufacturer BGA (Ball Grid Array) represents a mainstream integrated circuit packaging technology. Its core characteristic lies in the substitution of traditional peripheral pins with an array of solder balls positioned at t...
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China 64gb 128gb Bga Nand FlashAutomobile - Accessories - Jiangsu RuiXIN Microelectronics Co., LTD - China - July 9, 2026 - 1.00 Dollar US$Our 64GB 128GB BGA NAND flash delivers compact, high-performance storage in a Ball Grid Array package. Designed for soldered-down applications, this high density BGA NAND module provides excellent electrical and thermal performance while maintaining ...
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256gb 512gb High Capacity BgaAutomobile - Accessories - Jiangsu RuiXIN Microelectronics Co., LTD - China - July 9, 2026 - 1.00 Dollar US$
Our 256GB 512GB high capacity BGA NAND provides massive storage density in a compact Ball Grid Array package. Designed for soldered-down applications, this high density 512GB BGA NAND module delivers exceptional performance, thermal efficiency, and m...